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SN74ABT2244ADBRG4

Texas Instruments

SN74ABT2244ADBRG4 by Texas Instruments

SN74ABT2244ADBRG4 by Texas Instruments is a 20-terminal bus driver with 5.6 ns propagation delay, suitable for industrial applications. It features 3-state output characteristics, operates at a supply voltage of 5V, and has a max power supply current of 30mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,512 parts In-Stock

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Digiode

USA . 303 parts In-Stock

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303

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Distributors (Availability)

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AZTECH Wire

Italy . 708 parts In-Stock

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$6.365

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708

$6.365

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One Stop Electronics

USA . 1,551 parts In-Stock

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$14.000

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Parana Technologies

USA . 1,175 parts In-Stock

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$25.338

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$25.962

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$25.338

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$25.962

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DigiPath Technology Company

USA . 461 parts In-Stock

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$27.901

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461

$27.901

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ChromeModa Solutions

Germany . 1,347 parts In-Stock

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$28.470

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$23.345

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1,347

$28.470

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IDEA Electronic Components Group

UK . 997 parts In-Stock

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$28.470

100+ parts

$27.046

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$25.623

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997

$28.470

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$25.623

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Component Stockers USA

USA . 539 parts In-Stock

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$99.990

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Corphita

USA . 2,076 parts In-Stock

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Microchip USA

USA . 1,260 parts In-Stock

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Overview

Enhance your electronic designs with the SN74ABT2244ADBRG4 by Texas Instruments! This top-of-the-line Bus Driver & Transceiver ensures high-quality performance and reliability, thanks to Texas Instruments' renowned reputation for excellence. Perfect for a wide range of applications, this product offers customers unmatched value with its exceptional features and benefits. Upgrade your projects today with the SN74ABT2244ADBRG4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is suitable for rugged environments and provides good protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 5.6 ns

Low propagation delay ensures fast and efficient signal transmission within the circuit, making the product reliable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, leading to a compact and cost-effective design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and optimized performance of the bus driver & transceivers in various circuit configurations.

Power Supplies (V): 5

Consistent power supply voltage ensures reliable operation and prevents damage to internal components, enhancing product longevity.

No. of Terminals: 20

Having a sufficient number of terminals enables versatile connectivity options and facilitates integration into complex electronic systems.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor offers flexibility in controlling the output signal, allowing for efficient communication with other components.

Technology: BICMOS

Utilizing BICMOS technology provides a balance between performance and power consumption, making the product suitable for high-speed and low-power applications.

Technical Specifications

Bus Driver & Transceivers SN74ABT2244ADBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

5.6 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT2244ADBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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