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SN74ABT16833DLRG4

Texas Instruments

SN74ABT16833DLRG4 by Texas Instruments

SN74ABT16833DLRG4 by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and 3-STATE output characteristics. It operates at a nominal voltage of 5V with a propagation delay of 4.3ns, suitable for bidirectional control applications in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,707 parts In-Stock

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7,707

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Digiode

USA . 3,762 parts In-Stock

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3,762

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Distributors (Availability)

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Andel Nordic

Denmark . 2,213 parts In-Stock

1+ parts

$1.359

100+ parts

-

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$1.304

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$1.304

2,213

$1.359

-

$1.304

$1.304

AZTECH Wire

Italy . 257 parts In-Stock

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$18.524

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257

$18.524

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One Stop Electronics

USA . 1,062 parts In-Stock

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$30.000

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1,062

$30.000

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Parana Technologies

USA . 1,046 parts In-Stock

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$30.034

100+ parts

$2,789.107

1k+ parts

$27.031

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1,046

$30.034

$2,789.107

$27.031

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DigiPath Technology Company

USA . 889 parts In-Stock

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$33.071

100+ parts

$30.425

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889

$33.071

$30.425

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$33.746

100+ parts

$32.059

1k+ parts

$30.371

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1,729

$33.746

$32.059

$30.371

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ChromeModa Solutions

Germany . 1,362 parts In-Stock

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$33.746

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$27.672

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1,362

$33.746

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Microchip USA

USA . 2,936 parts In-Stock

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Corphita

USA . 1,629 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the SN74ABT16833DLRG4 by Texas Instruments, a leading manufacturer in the industry. Designed for precision and efficiency, this Bus Driver & Transceiver offers seamless integration and exceptional functionality in various applications. Experience the value of Texas Instruments' superior quality and innovation, providing customers with unmatched benefits and advantages. Elevate your projects with the SN74ABT16833DLRG4 and discover the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-lasting performance

Propagation Delay At Nominal Supply: 4.3 ns

Fast signal propagation for efficient communication

Surface Mount: YES

Easy installation and space-saving design

No. of Functions: 2

Multiple functions in a single component for enhanced functionality

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for compatibility with various systems

Package Shape: RECTANGULAR

Compact design for easy integration into circuit boards

No. of Bits: 8

8-bit data processing capability for versatile applications

Power Supplies (V): 5

Consistent power supply for stable operation

No. of Terminals: 56

Sufficient terminals for connections and signal transmission

Maximum I (ol): 64 Amp

High output current capacity for driving bus lines

Output Characteristics: 3-STATE

Ability to drive bus lines with multiple states for flexibility

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions

Technical Specifications

Bus Driver & Transceivers SN74ABT16833DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

4.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74ABT16833DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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