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SN74ABT16500BDLG4

Texas Instruments

SN74ABT16500BDLG4 by Texas Instruments

SN74ABT16500BDLG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 4.9 ns, operating at a supply voltage of 5V. It features a 3-STATE output and is ideal for bidirectional control applications in industrial settings due to its BICMOS technology and negative edge trigger type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,062 parts In-Stock

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Digiode

USA . 2,369 parts In-Stock

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2,369

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Distributors (Availability)

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AZTECH Wire

Italy . 891 parts In-Stock

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$7.834

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Andel Nordic

Denmark . 3,574 parts In-Stock

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$9.080

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$8.717

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$8.717

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$8.717

Parana Technologies

USA . 1,984 parts In-Stock

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$11.313

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$11.746

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ChromeModa Solutions

Germany . 3,663 parts In-Stock

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$12.711

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$10.423

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

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$12.711

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$12.075

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$11.440

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One Stop Electronics

USA . 1,283 parts In-Stock

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$32.000

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Corphita

USA . 4,676 parts In-Stock

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Microchip USA

USA . 2,186 parts In-Stock

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DigiPath Technology Company

USA . 1,262 parts In-Stock

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$11.460

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Overview

Enhance your electronic designs with the SN74ABT16500BDLG4 by Texas Instruments, a high-quality Bus Driver & Transceiver component that offers reliable performance and versatility. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust in the durability and efficiency of this product. Ideal for a wide range of applications, this 18-bit device provides seamless data transmission and control, ensuring optimized functionality for your projects. Experience the value and benefits of superior technology with the SN74ABT16500BDLG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast and efficient data transmission in the bus system.

No. of Bits: 18

Higher number of bits allows for more data to be processed simultaneously, making the product suitable for complex communication systems.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without distortion or interference.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to function reliably in a variety of environmental conditions.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ABT16500BDLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.41 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

NEGATIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74ABT16500BDLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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