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SN74ABT162827DGGR

Texas Instruments

SN74ABT162827DGGR by Texas Instruments

SN74ABT162827DGGR by Texas Instruments is a Bus Driver & Transceiver with 10 bits, 4.7 ns propagation delay, and 3-state output. It operates at a voltage range of 4.5V to 5.5V and has a max power supply current of 32mA. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package style and dual terminal position.

Median Price

$3.962

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.170

1k+ parts

$2.840

10k+ parts

$2.670

1,000

-

$3.170

$2.840

$2.670

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.180

1k+ parts

-

10k+ parts

-

1,000

-

$4.180

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.962

1k+ parts

$3.550

10k+ parts

$3.337

1,000

-

$3.962

$3.550

$3.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,421 parts In-Stock

1+ parts

$3.344

100+ parts

-

1k+ parts

-

10k+ parts

-

2,421

$3.344

-

-

-

Vyrian

USA . 7,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,619

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,839 parts In-Stock

1+ parts

$3.168

100+ parts

-

1k+ parts

-

10k+ parts

-

4,839

$3.168

-

-

-

Andel Nordic

Denmark . 4,107 parts In-Stock

1+ parts

$5.413

100+ parts

-

1k+ parts

$5.196

10k+ parts

$5.196

4,107

$5.413

-

$5.196

$5.196

Parana Technologies

USA . 1,148 parts In-Stock

1+ parts

$26.738

100+ parts

-

1k+ parts

$27.980

10k+ parts

-

1,148

$26.738

-

$27.980

-

DigiPath Technology Company

USA . 1,787 parts In-Stock

1+ parts

$29.442

100+ parts

$27.087

1k+ parts

-

10k+ parts

-

1,787

$29.442

$27.087

-

-

ChromeModa Solutions

Germany . 1,072 parts In-Stock

1+ parts

$30.043

100+ parts

$24.635

1k+ parts

-

10k+ parts

-

1,072

$30.043

$24.635

-

-

IDEA Electronic Components Group

UK . 446 parts In-Stock

1+ parts

$30.043

100+ parts

$28.541

1k+ parts

$27.039

10k+ parts

-

446

$30.043

$28.541

$27.039

-

Overview

Elevate your electronic projects with the SN74ABT162827DGGR by Texas Instruments. Crafted with precision and expertise, this bus driver and transceiver ensures top-notch performance and reliability. Perfect for a variety of applications, this versatile component offers seamless integration and exceptional value. Experience the quality and innovation that Texas Instruments is known for, and take your projects to the next level with the SN74ABT162827DGGR. Unlock endless possibilities with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 4.7 ns

The low propagation delay ensures fast signal processing and efficient communication.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

No. of Functions: 2

Having multiple functions in a single device provides versatility and flexibility in application.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and easily accessible, making integration into existing systems straightforward.

No. of Terminals: 56

With a high number of terminals, this product offers ample connectivity options for other components.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The output characteristics with series resistor allow for better signal integrity and reduced interference.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in harsh conditions.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on PCBs, saving space and reducing overall size.

Technical Specifications

Bus Driver & Transceivers SN74ABT162827DGGR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

SN74ABT162827DGGR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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