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SN74ABT162823ADLR

Texas Instruments

SN74ABT162823ADLR by Texas Instruments

SN74ABT162823ADLR by Texas Instruments is a 9-bit bus driver with 3-state output and 7.5 ns propagation delay at 5V supply voltage. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max frequency of 150 MHz. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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R&J Components

USA . 15,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

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Vyrian

USA . 3,068 parts In-Stock

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Digiode

USA . 1,104 parts In-Stock

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AZTECH Wire

Italy . 350 parts In-Stock

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$11.888

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350

$11.888

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Andel Nordic

Denmark . 1,934 parts In-Stock

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$13.269

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$12.738

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$12.738

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$12.738

One Stop Electronics

USA . 1,408 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 1,752 parts In-Stock

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$19.368

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$1,798.629

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$17.431

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$1,798.629

$17.431

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DigiPath Technology Company

USA . 1,690 parts In-Stock

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$21.327

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$21.327

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ChromeModa Solutions

Germany . 582 parts In-Stock

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$21.762

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$17.845

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$21.762

$17.845

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IDEA Electronic Components Group

UK . 26 parts In-Stock

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$21.762

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$20.674

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$19.586

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Corphita

USA . 2,656 parts In-Stock

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Kepictronics

USA . 1,895 parts In-Stock

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Microchip USA

USA . 110 parts In-Stock

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Overview

Upgrade your electronic designs with the high-quality SN74ABT162823ADLR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable Bus Driver & Transceivers that are essential for seamless data transmission in various applications. This versatile product offers customers exceptional value with its fast propagation delay, low power consumption, and 3-state output characteristics. Trust Texas Instruments to provide top-notch components for your next project, ensuring optimal performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 7.5 ns

With a low propagation delay, this product ensures fast and efficient data transmission.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the product onto PCBs.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space on the PCB.

No. of Bits: 9

The 9-bit capability of this product allows for a higher data resolution and processing capacity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage levels in electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and stability in various circuit configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Maximum Frequency At Nominal Supply: 150000000 Hz

The high maximum frequency capability allows for high-speed data transmission in applications requiring fast processing.

Technical Specifications

Bus Driver & Transceivers SN74ABT162823ADLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND CLOCK ENABLE

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

12 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74ABT162823ADLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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