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SN74ABT162244DGG

Texas Instruments

SN74ABT162244DGG by Texas Instruments

SN74ABT162244DGG by Texas Instruments is a 4-bit bus driver with 4.8 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and features a max operating temperature of 85°C. This surface-mount device has a small outline package with dual terminal position and Gull Wing form factor.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.690

1k+ parts

$1.510

10k+ parts

$1.420

120

-

$1.690

$1.510

$1.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$1.776

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632

$1.776

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Bristol Electronics

USA . 5,340 parts In-Stock

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5,340

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Vyrian

USA . 3,409 parts In-Stock

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3,409

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Inland Empire Components Inc.

USA . 20 parts In-Stock

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20

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Prism Electronics

USA . 1 parts In-Stock

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1

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,912 parts In-Stock

1+ parts

$1.683

100+ parts

-

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2,912

$1.683

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Andel Nordic

Denmark . 3,239 parts In-Stock

1+ parts

$7.477

100+ parts

-

1k+ parts

$7.178

10k+ parts

$7.178

3,239

$7.477

-

$7.178

$7.178

Microchip USA

USA . 1,564 parts In-Stock

1+ parts

$11.700

100+ parts

$11.630

1k+ parts

$11.590

10k+ parts

$11.560

1,564

$11.700

$11.630

$11.590

$11.560

AZTECH Wire

Italy . 89 parts In-Stock

1+ parts

$12.420

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-

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89

$12.420

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Parana Technologies

USA . 1,151 parts In-Stock

1+ parts

$22.996

100+ parts

$2,135.511

1k+ parts

$20.696

10k+ parts

-

1,151

$22.996

$2,135.511

$20.696

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DigiPath Technology Company

USA . 1,099 parts In-Stock

1+ parts

$25.321

100+ parts

$23.296

1k+ parts

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1,099

$25.321

$23.296

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ChromeModa Solutions

Germany . 2,055 parts In-Stock

1+ parts

$25.838

100+ parts

$21.187

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2,055

$25.838

$21.187

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IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$25.838

100+ parts

$24.546

1k+ parts

$23.254

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637

$25.838

$24.546

$23.254

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Kepictronics

USA . 89 parts In-Stock

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89

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Perfect Parts

USA . 1 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74ABT162244DGG by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver boasts unparalleled quality and reliability. Ideal for a wide range of applications, this versatile component offers customers value beyond measure. Experience lightning-fast propagation delay, robust output characteristics, and a compact package shape that sets new standards in performance. Elevate your projects with Texas Instruments and discover endless possibilities with the SN74ABT162244DGG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers, making it a long-lasting and reliable choice.

Propagation Delay At Nominal Supply: 4.8 ns

With a fast propagation delay of 4.8 ns at nominal supply voltage, this product ensures quick signal transmission, making it suitable for high-speed data communication applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, making the integration of this product seamless and efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V, this product is compatible with a wide range of electronic systems and can be easily integrated into existing setups.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand higher temperature environments, making it suitable for industrial applications where heat dissipation is a concern.

Technical Specifications

Bus Driver & Transceivers SN74ABT162244DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C; 25 OHM OUTPUT SERIES RESISTOR

Control Type:

ENABLE LOW

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74ABT162244DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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