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SN7416N

Texas Instruments

SN7416N by Texas Instruments

SN7416N by Texas Instruments is a TTL logic gate with 6 functions, 23 ns propagation delay at 5V. It has open-collector output characteristics and operates b/w 0-70°C. Ideal for applications requiring fast signal processing in commercial-grade environments.

Median Price

$1.525

Lifecycle Status

Suppliers In-Stock

70

In-Stock Inventory

1k+

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Mouser Electronics

USA . 612 parts In-Stock

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$2.810

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$1.720

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$1.440

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$2.810

$1.720

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$1.440

Rochester

USA . 522 parts In-Stock

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$1.360

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DigiKey

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Verical

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Arrow

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DF Sales Co.

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TEDSS.com

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Freelance Electronics

USA . 62 parts In-Stock

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Component Electronics Inc.

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Ashlea Components Ltd

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Atlantic Semiconductor

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Digital Electronic Gebert Verwaltungs UG

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France . 3 parts In-Stock

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Corphita

USA . 2,550 parts In-Stock

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$1.170

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Continental Prestige Electronics

USA . 208 parts In-Stock

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$2.060

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Parana Technologies

USA . 932 parts In-Stock

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$1,073.293

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$10.402

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DigiPath Technology Company

USA . 1,630 parts In-Stock

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$12.726

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$11.708

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ChromeModa Solutions

Germany . 1,957 parts In-Stock

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IDEA Electronic Components Group

UK . 1,621 parts In-Stock

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Overview

Elevate your logic gate game with the Texas Instruments SN7416N. Crafted with precision and reliability in mind, this product offers unparalleled performance in a variety of applications. Whether you're designing circuits for automation, robotics, or digital signal processing, the SN7416N delivers seamless operation and efficient functionality. Trust in Texas Instruments' expertise and experience to bring you a high-quality solution that exceeds expectations. Upgrade your projects today with the SN7416N and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay of 23 ns ensures fast response times, making this product ideal for high-speed applications.

No. of Functions: 6

Having 6 functions in one package offers versatility and flexibility in circuit design, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common 5V supply voltage, making it compatible with a wide range of systems and applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature range, suitable for most commercial and industrial environments.

Technology: TTL

TTL (Transistor-Transistor Logic) technology provides high-speed performance and compatibility with other TTL devices, making it a reliable choice for digital circuits.

Technical Specifications

Logic Gates SN7416N attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IOL = 40MA @ VOL = 0.7V; IOH = 0.25MA @ VOH = 15V

Family:

TTL/H/L

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

40 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

51 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

6.35 mm

Trade Compliance

SN7416N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-105-5889, 5962011055889, 5962-01-149-2389, 5962011492389

NIIN

011055889, 011492389

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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