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SN7404NSRG4

Texas Instruments

SN7404NSRG4 by Texas Instruments

SN7404NSRG4 by Texas Instruments is a TTL logic gate with 6 functions, 22 ns propagation delay at 5V. It comes in a small outline package suitable for surface mount applications. Operating temperature range is 0-70°C, making it ideal for commercial use in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,798 parts In-Stock

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Vyrian

USA . 2,561 parts In-Stock

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2,561

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Distributors (Availability)

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AZTECH Wire

Italy . 241 parts In-Stock

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$5.835

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241

$5.835

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Parana Technologies

USA . 2,043 parts In-Stock

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$25.097

100+ parts

$2,330.647

1k+ parts

$22.587

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2,043

$25.097

$2,330.647

$22.587

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DigiPath Technology Company

USA . 1,871 parts In-Stock

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$27.635

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$27.635

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ChromeModa Solutions

Germany . 5,151 parts In-Stock

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$28.199

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$23.123

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5,151

$28.199

$23.123

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

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$28.199

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$26.789

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$25.379

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1,584

$28.199

$26.789

$25.379

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One Stop Electronics

USA . 521 parts In-Stock

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$44.000

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521

$44.000

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Microchip USA

USA . 5,828 parts In-Stock

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Corphita

USA . 4,047 parts In-Stock

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Overview

Enhance your electronics projects with the SN7404NSRG4 by Texas Instruments, a high-quality logic gate that guarantees reliability and performance. Crafted by a renowned manufacturer, this versatile component is perfect for a wide range of applications in various industries. With its fast propagation delay and low power consumption, this product offers exceptional value to customers seeking precision and efficiency in their designs. Trust in Texas Instruments to deliver top-notch technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast operation of the logic gates, making them suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes these logic gates compatible with a wide range of electronic systems.

Load Capacitance (CL): 15 pF

With a low load capacitance, these logic gates can drive capacitive loads efficiently without significant signal degradation.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows these logic gates to be used in various environmental conditions without risk of overheating.

Technical Specifications

Logic Gates SN7404NSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G14

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

33 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN7404NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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