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SN55108BW

Texas Instruments

SN55108BW by Texas Instruments

SN55108BW by Texas Instruments is a Line Receiver IC with 2 functions, operating at -55 to 125°C. It features open-collector output, differential input, and a max supply voltage of ±5V. Ideal for military-grade applications requiring fast response times with a max receive delay of 25ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,996 parts In-Stock

1+ parts

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3,996

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Vyrian

USA . 3,044 parts In-Stock

1+ parts

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3,044

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 600 parts In-Stock

1+ parts

$5.935

100+ parts

-

1k+ parts

$6.718

10k+ parts

-

600

$5.935

-

$6.718

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$6.536

100+ parts

$6.013

1k+ parts

-

10k+ parts

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787

$6.536

$6.013

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ChromeModa Solutions

Germany . 4,918 parts In-Stock

1+ parts

$6.669

100+ parts

$5.469

1k+ parts

-

10k+ parts

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4,918

$6.669

$5.469

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$6.669

100+ parts

-

1k+ parts

$6.002

10k+ parts

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1,606

$6.669

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$6.002

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One Stop Electronics

USA . 1,270 parts In-Stock

1+ parts

$7.500

100+ parts

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1,270

$7.500

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AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$17.954

100+ parts

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895

$17.954

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Corphita

USA . 703 parts In-Stock

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703

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Overview

Unleash the power of seamless communication with the SN55108BW by Texas Instruments, a top-of-the-line line driver and receiver designed to exceed all expectations. Crafted with precision using high-quality ceramic and glass-sealed materials, this product delivers unrivaled performance and reliability in various applications. With its dual terminal position and open-collector output characteristics, the SN55108BW ensures seamless integration and optimal functionality. Trust in Texas Instruments' reputation for excellence and invest in the SN55108BW for unmatched value and unparalleled benefits that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing versatility in different circuit setups.

Temperature Grade: MILITARY

Designed to meet stringent military standards for performance and reliability in challenging environments.

Output Characteristics: OPEN-COLLECTOR

Allows for easy interfacing with other components or systems, enhancing connectivity and versatility.

Technical Specifications

Line Drivers & Receivers SN55108BW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ADDITIONAL COMMON STROBE INPUT

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.29 mm

Trade Compliance

SN55108BW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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