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SN55108AJ

Texas Instruments

SN55108AJ by Texas Instruments

SN55108AJ by Texas Instruments is a Line Receiver IC with 2 functions, operating at -55 to 125 °C. It has a supply voltage range of +-5 V and max output low current of 16 Amp. Ideal for military-grade applications requiring open-collector output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,927 parts In-Stock

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Digiode

USA . 5,214 parts In-Stock

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Sinequanon

UK . 37 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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ECAB

Sweden . 2 parts In-Stock

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Resion

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Parana Technologies

USA . 1,248 parts In-Stock

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$6.466

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$7.211

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$6.466

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ChromeModa Solutions

Germany . 4,684 parts In-Stock

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$7.265

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$5.957

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$7.265

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IDEA Electronic Components Group

UK . 1,410 parts In-Stock

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$7.265

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$6.538

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One Stop Electronics

USA . 751 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$11.764

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Component Stockers USA

USA . 399 parts In-Stock

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$99.990

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Corphita

USA . 3,907 parts In-Stock

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DigiPath Technology Company

USA . 1,494 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Supply Digital

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Kepictronics

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Overview

Discover the unbeatable quality and reliability of the SN55108AJ by Texas Instruments, a top-tier manufacturer in the electronic components industry. This line driver and receiver offers unmatched performance for a wide range of applications, providing customers with seamless communication solutions. With its advanced technology, dual terminal position, and military-grade temperature grade, this product ensures optimal functionality under extreme conditions. Experience the value and benefits of choosing Texas Instruments for your electronic needs - trust in excellence, trust in innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

Can safely operate within a wide range of supply voltages, providing flexibility in different applications.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying design.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs or systems.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other devices and systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Technology: BIPOLAR

Bipolar technology provides high-speed operation and low power consumption, enhancing performance.

Technical Specifications

Line Drivers & Receivers SN55108AJ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ADDITIONAL COMMON STROBE INPUT

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN55108AJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-011-2977, 5962000112977, 5962-00-506-3087, 5962005063087

NIIN

000112977, 005063087

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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