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SN5510AFK

Texas Instruments

SN5510AFK by Texas Instruments

SN5510AFK by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -55 to 125 °C. It features V.35 interface standard, BIPOLAR technology, and 25 ns max transmit delay. Ideal for military-grade applications requiring differential output and gated input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,251 parts In-Stock

1+ parts

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8,251

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Digiode

USA . 3,002 parts In-Stock

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3,002

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$10.166

100+ parts

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720

$10.166

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Parana Technologies

USA . 298 parts In-Stock

1+ parts

$11.796

100+ parts

-

1k+ parts

$12.198

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298

$11.796

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$12.198

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ChromeModa Solutions

Germany . 4,577 parts In-Stock

1+ parts

$13.254

100+ parts

$10.868

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4,577

$13.254

$10.868

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IDEA Electronic Components Group

UK . 794 parts In-Stock

1+ parts

$13.254

100+ parts

$12.591

1k+ parts

$11.929

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794

$13.254

$12.591

$11.929

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One Stop Electronics

USA . 406 parts In-Stock

1+ parts

$22.500

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406

$22.500

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Corphita

USA . 4,609 parts In-Stock

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4,609

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DigiPath Technology Company

USA . 1,109 parts In-Stock

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$11.950

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1,109

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$11.950

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Overview

Unlock the power of seamless data transmission with the SN5510AFK by Texas Instruments. Crafted with precision using high-quality materials, this line driver and receiver offers unmatched reliability and performance. Ideal for a wide range of applications, this product ensures smooth and efficient communication. Experience enhanced connectivity and superior signal integrity with the SN5510AFK, designed to meet your needs with unparalleled value and benefits. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability for the product.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs effectively.

No. of Functions: 2

Offers multiple functions in a single package, saving space and cost.

Package Shape: SQUARE

Compact design for efficient use of space on the board.

Maximum Transmit Delay: 25 ns

Ensures fast signal transmission.

No. of Terminals: 20

Provides multiple connection points for versatile applications.

Package Style (Meter): CHIP CARRIER

Ideal for applications requiring a small form factor.

Minimum Supply Voltage: 4.5 V

Can operate effectively at lower voltage levels.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments.

Minimum Operating Temperature: -55 °C

Functions reliably even in extremely cold conditions.

Terminal Position: QUAD

Allows for easy and secure connections.

Maximum Seated Height: 2.03 mm

Low profile design for space-constrained applications.

Width: 8.89 mm

Compact width for efficient board layout.

Differential Output: YES

Provides differential signaling for noise immunity.

Length: 8.89 mm

Compact length for space-saving installation.

Temperature Grade: MILITARY

Suitable for rugged military applications.

Maximum Receive Delay: 0 ns

Ensures minimal delay in receiving signals.

Technology: BIPOLAR

Utilizes bipolar technology for reliable performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly use.

Interface Standard: V.35

Complies with industry-standard interfaces for compatibility.

Input Characteristics: GATED

Gated input characteristics for precise signal control.

Nominal Supply Voltage: 5 V

Operates at the industry-standard voltage level.

Nominal Negative Supply Voltage: -5 V

Provides a balanced negative supply voltage.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration.

Driver No. of Bits: 2

Supports 2 bits for flexible signal processing.

Interface IC Type: LINE DRIVER

Designed specifically for driving signals along a communication line.

Technical Specifications

Line Drivers & Receivers SN5510AFK attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

HIGH DRIVE

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

V.35

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

25 ns

Width:

8.89 mm

Trade Compliance

SN5510AFK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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