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SN55107AWR

Texas Instruments

SN55107AWR by Texas Instruments

SN55107AWR by Texas Instruments is a Line Receiver IC with 2 functions, operating at -55 to 125°C. It features a supply voltage range of 4.5-5.5V and a max receive delay of 25ns. Ideal for military-grade applications requiring true output polarity and differential Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,706 parts In-Stock

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4,706

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Digiode

USA . 2,201 parts In-Stock

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2,201

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Distributors (Availability)

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Parana Technologies

USA . 665 parts In-Stock

1+ parts

$2.306

100+ parts

-

1k+ parts

$2.806

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665

$2.306

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$2.806

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ChromeModa Solutions

Germany . 2,219 parts In-Stock

1+ parts

$2.591

100+ parts

$2.125

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$2.591

$2.125

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

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$2.591

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$2.332

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2,201

$2.591

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$2.332

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AZTECH Wire

Italy . 627 parts In-Stock

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$16.913

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627

$16.913

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One Stop Electronics

USA . 1,182 parts In-Stock

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$36.500

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$36.500

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Corphita

USA . 1,482 parts In-Stock

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DigiPath Technology Company

USA . 1,198 parts In-Stock

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$2.336

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$2.336

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Overview

Enhance your electronic projects with the SN55107AWR by Texas Instruments, a top-of-the-line Line Driver & Receiver. Crafted with precision and quality in mind, this product offers unmatched reliability and performance. Ideal for military-grade applications, this device features true output polarity and differential Schmitt trigger input characteristics. With a compact rectangular design and glass-sealed body material, the SN55107AWR ensures seamless integration into any project. Experience the value and benefits of Texas Instruments' cutting-edge technology - upgrade to the SN55107AWR today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 2

Provides dual functionality in a single unit, saving cost and board space.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

No. of Terminals: 14

Offers multiple connection points for enhanced connectivity and flexibility.

Package Style (Meter): FLATPACK

Sleek and compact design for efficient use of space on PCBs.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for harsh environments.

Output Characteristics: TOTEM-POLE

Provides strong and stable output signals for robust communication.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold conditions without compromising performance.

Terminal Position: DUAL

Allows for versatile mounting options and connection configurations.

Maximum Seated Height: 2.03 mm

Low profile design for space-constrained applications.

Width: 6.29 mm

Compact form factor for efficient PCB layout.

Output Polarity: TRUE

Provides accurate and reliable output signal polarity.

Receiver No. of Bits: 2

Suitable for applications requiring 2-bit signal reception.

Length: 9.21 mm

Optimal size for easy integration into circuit designs.

Temperature Grade: MILITARY

Meets stringent military standards for ruggedness and reliability.

Maximum Receive Delay: 25 ns

Ensures fast and efficient signal reception and processing.

Technology: BIPOLAR

Offers high-speed performance and precise signal handling.

Terminal Form: FLAT

Simplifies soldering and connection processes for easy installation.

Maximum Supply Current: 30 mA

Low power consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides noise immunity and signal conditioning for reliable data transmission.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with common power sources.

Nominal Negative Supply Voltage: -5 V

Supports dual power supply configurations for signal integrity.

Terminal Pitch: 1.27 mm

Standard spacing for easy connection to other components on PCB.

Interface IC Type: LINE RECEIVER

Specifically designed for receiving and processing line signals, ensuring accuracy and reliability in communication.

Technical Specifications

Line Drivers & Receivers SN55107AWR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ADDITIONAL COMMON STROBE INPUT

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.03 mm

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SN55107AWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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