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SN55LBC180RSAT

Texas Instruments

SN55LBC180RSAT by Texas Instruments

SN55LBC180RSAT by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at -55 to 125 °C. It features a max supply voltage of 5.25 V, true output polarity, and differential output for EIA-485 and ISO 8482 interfaces. Ideal for military-grade applications requiring fast transmission speeds and low power consumption.

Median Price

$4.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 699 parts In-Stock

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-

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-

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$4.270

10k+ parts

$3.520

699

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$4.270

$3.520

Distributors (In-Stock)

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Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$3.961

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71

$3.961

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Chip Stock

USA . 11,200 parts In-Stock

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Vyrian

USA . 5,233 parts In-Stock

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Digiode

USA . 708 parts In-Stock

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Semicontronic

India . 532 parts In-Stock

1+ parts

$3.630

100+ parts

$3.539

1k+ parts

$3.521

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-

532

$3.630

$3.539

$3.521

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Aztec Data Supply Inc.

USA . 4,986 parts In-Stock

1+ parts

$3.650

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$3.650

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Argo Parts USA

USA . 4,242 parts In-Stock

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$3.961

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$3.961

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Continental Prestige Electronics

USA . 4,219 parts In-Stock

1+ parts

$3.961

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$3.881

4,219

$3.961

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$3.881

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.961

100+ parts

-

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$3.763

10k+ parts

$3.683

500

$3.961

-

$3.763

$3.683

Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$4.594

100+ parts

$4.227

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$3.961

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16

$4.594

$4.227

$3.961

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AZTECH Wire

Italy . 862 parts In-Stock

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$5.054

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Ampacity Inc.

Singapore . 252 parts In-Stock

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$7.900

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$7.900

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Parana Technologies

USA . 2,228 parts In-Stock

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$8.537

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$9.195

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$8.537

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$9.195

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ChromeModa Solutions

Germany . 5,388 parts In-Stock

1+ parts

$9.592

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$7.865

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$7.865

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IDEA Electronic Components Group

UK . 1,856 parts In-Stock

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$9.592

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$9.112

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$8.633

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$9.592

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$8.633

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Microchip USA

USA . 1,601 parts In-Stock

1+ parts

$25.020

100+ parts

$24.870

1k+ parts

$24.790

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$24.710

1,601

$25.020

$24.870

$24.790

$24.710

Infinite Electronics LLP (Excess)

. 20,009 parts In-Stock

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Lixinc

USA . 19,723 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,383 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Perfect Parts

USA . 4,820 parts In-Stock

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$8.648

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 162 parts In-Stock

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Overview

Unleash the power of seamless communication with the SN55LBC180RSAT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their line drivers & receivers. This versatile product is perfect for a wide range of applications, providing unparalleled value and benefits to customers. With its advanced technology and high-performance features, the SN55LBC180RSAT offers a competitive edge in data transmission, making it the ideal choice for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside the package, making it suitable for various environments.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, providing flexibility in different applications.

Maximum Transmit Delay: 18 ns

The low transmit delay ensures fast and efficient data transmission, making this product ideal for high-speed communication systems.

Output Polarity: TRUE

Having a true output polarity ensures compatibility with devices that require a specific output signal, increasing the versatility of this product.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product is reliable and durable in harsh operating conditions, making it suitable for mission-critical applications.

Interface Standard: EIA-485; ISO 8482

Compliance with industry standards ensures seamless integration with other equipment and systems, making this product a reliable choice for various communication setups.

Technical Specifications

Line Drivers & Receivers SN55LBC180RSAT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; ISO 8482

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

.1 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

33 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

18 ns

Width:

4 mm

Trade Compliance

SN55LBC180RSAT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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