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SN54S283J

Texas Instruments

SN54S283J by Texas Instruments

SN54S283J by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 18 ns at 5V. It operates in a temperature range from -55°C to 125°C and has a max power supply current of 160 mA. Ideal for military-grade applications requiring fast arithmetic calculations.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Vyrian

USA . 4,714 parts In-Stock

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Digiode

USA . 2,848 parts In-Stock

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ECAB

Sweden . 24 parts In-Stock

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Electronic Expediters

USA . 15 parts In-Stock

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Beltway Electronics Company

USA . 11 parts In-Stock

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Prism Electronics

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Resion

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 834 parts In-Stock

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$8.268

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Andel Nordic

Denmark . 176 parts In-Stock

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$8.880

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Parana Technologies

USA . 2,089 parts In-Stock

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$12.488

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$1,159.745

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DigiPath Technology Company

USA . 276 parts In-Stock

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ChromeModa Solutions

Germany . 6,134 parts In-Stock

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IDEA Electronic Components Group

UK . 385 parts In-Stock

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$13.330

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One Stop Electronics

USA . 252 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

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Corphita

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Assy Fe

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Overview

Experience unparalleled quality and reliability with the SN54S283J digital arithmetic circuit by Texas Instruments. Crafted from top-grade ceramic and glass-sealed materials, this product ensures optimal performance in various applications. With a fast propagation delay of 18ns and a maximum operating temperature of 125°C, this component delivers superior efficiency and precision. Trust Texas Instruments for cutting-edge technology and innovation that elevates your projects to new heights. Choose the SN54S283J for unmatched value and benefits that meet all your circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures a high level of durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay of 18 ns ensures quick and efficient processing of signals, making this product suitable for high-speed arithmetic calculations.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can handle a range of mathematical operations with precision and accuracy, making it suitable for various data processing tasks.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage provides a stable power source for the circuit, ensuring reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand harsh environmental conditions, making it suitable for use in extreme temperature environments.

Technology: TTL

Being based on TTL technology, this circuit offers high speed and low power consumption, making it an efficient choice for digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN54S283J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING

Family:

S

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54S283J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-158-1802, 5962011581802

NIIN

011581802

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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