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PMS430E325FZR

Texas Instruments

PMS430E325FZR by Texas Instruments

PMS430E325FZR by Texas Instruments is a 68-terminal microcontroller with 3.3 MHz clock frequency, ideal for low-power applications. Featuring ADC channels and UVPROM ROM programmability, it operates b/w 2.7V to 5.5V supply voltage range in CMOS technology, making it suitable for various embedded systems requiring high performance in a compact square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,745 parts In-Stock

1+ parts

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4,745

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Digiode

USA . 2,571 parts In-Stock

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2,571

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$6.355

100+ parts

-

1k+ parts

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629

$6.355

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One Stop Electronics

USA . 1,232 parts In-Stock

1+ parts

$29.000

100+ parts

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1,232

$29.000

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Parana Technologies

USA . 2,046 parts In-Stock

1+ parts

$52.394

100+ parts

$4,865.606

1k+ parts

$47.155

10k+ parts

-

2,046

$52.394

$4,865.606

$47.155

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DigiPath Technology Company

USA . 1,535 parts In-Stock

1+ parts

$57.693

100+ parts

$53.077

1k+ parts

-

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1,535

$57.693

$53.077

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ChromeModa Solutions

Germany . 6,209 parts In-Stock

1+ parts

$58.870

100+ parts

$48.273

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6,209

$58.870

$48.273

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IDEA Electronic Components Group

UK . 740 parts In-Stock

1+ parts

$58.870

100+ parts

$55.926

1k+ parts

$52.983

10k+ parts

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740

$58.870

$55.926

$52.983

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Corphita

USA . 4,441 parts In-Stock

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4,441

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Overview

Discover the innovative PMS430E325FZR by Texas Instruments, a cutting-edge microcontroller that stands out for its superior quality and reliable performance. With Texas Instruments' reputation for excellence in manufacturing, this chip carrier package is perfect for a wide range of applications. From IoT devices to consumer electronics, this microcontroller offers unmatched value with its advanced technology, versatile features, and efficient design. Elevate your projects with the PMS430E325FZR and experience the benefits of precision engineering at its best.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller into compact electronic designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this microcontroller can handle higher power requirements without issues.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement in a circuit layout.

No. of Terminals: 68

Having 68 terminals provides flexibility in connecting various external components and peripherals to the microcontroller.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity and ease of handling during assembly.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage of 2.7V allows for efficient power consumption and operation in low-power applications.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion functionality, making the microcontroller suitable for sensor interfacing and signal processing applications.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and component placement, enhancing the overall design efficiency.

Maximum Clock Frequency: 3.3 MHz

The maximum clock frequency of 3.3MHz allows for fast processing speeds, ideal for applications requiring real-time data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient processing of instructions, making it suitable for a wide range of embedded control applications.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: J BEND

The J bend terminal form offers secure connections and easy soldering during assembly, ensuring reliable electrical contact.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is common in many electronic systems, allowing for easy integration with existing components.

ROM Programmability: UVPROM

The UVPROM programmability of the ROM enables flexible firmware updates and customization of the microcontroller's functionality without requiring external memory.

No. of I/O Lines: 14

Having 14 I/O lines provides sufficient connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers PMS430E325FZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-CQCC-J68

No. of I/O Lines:

14

No. of Terminals:

68

PWM Channels:

NO

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

ROM Programmability:

UVPROM

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

PMS430E325FZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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