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PMS430E315FZ

Texas Instruments

PMS430E315FZ by Texas Instruments

PMS430E315FZ by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 512 RAM bytes, and max clock frequency of 3.3 MHz. Ideal for industrial applications requiring a RISC-based microcontroller with ADC channels, operating temperature range from -40 to 85 °C, and power supplies of 3/5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,901 parts In-Stock

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Digiode

USA . 488 parts In-Stock

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488

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Distributors (Availability)

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AZTECH Wire

Italy . 610 parts In-Stock

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$18.631

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610

$18.631

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One Stop Electronics

USA . 1,554 parts In-Stock

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$31.000

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$31.000

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Parana Technologies

USA . 1,262 parts In-Stock

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$67.716

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1,262

$67.716

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DigiPath Technology Company

USA . 731 parts In-Stock

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$74.563

100+ parts

$68.598

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731

$74.563

$68.598

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ChromeModa Solutions

Germany . 2,441 parts In-Stock

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$76.085

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$62.390

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2,441

$76.085

$62.390

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

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$76.085

100+ parts

$72.281

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$68.476

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1,099

$76.085

$72.281

$68.476

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Component Stockers USA

USA . 280 parts In-Stock

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$99.990

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280

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Corphita

USA . 3,891 parts In-Stock

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Microchip USA

USA . 332 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments PMS430E315FZ microcontroller. Crafted with precision and expertise, this device is designed to elevate your projects to new heights. Whether you're creating smart home devices, robotics, or industrial automation solutions, this microcontroller offers unparalleled reliability and performance. With its advanced features and top-notch quality, the PMS430E315FZ is the perfect choice for developers looking to bring their ideas to life. Elevate your creations and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Ease of installation and space-saving design for modern electronic applications.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources, offering flexibility in design.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier handling during placement.

Bit Size: 16

Suitable for handling moderate to complex computational tasks efficiently.

Power Supplies (V): 3/5

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 68

Provides ample connectivity options for interfacing with other components or peripherals.

Minimum Supply Voltage: 2.7 V

Ensures operation even in low voltage conditions, increasing the product's reliability.

Maximum Operating Temperature: 85 °C

Can withstand higher temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in cold temperatures, offering versatility in deployment scenarios.

ADC Channels: YES

Supports analog-to-digital conversion for sensor interfacing or data acquisition applications.

Terminal Position: QUAD

Quad-terminal positioning provides stability during installation and reduces chances of misalignment.

ROM Words: 16384

Ample ROM capacity for storing program instructions or data, suitable for various applications.

Maximum Seated Height: 4.57 mm

Low profile design saves space and allows for compact system integration.

Width: 23.94 mm

Optimal width for fitting into standard PCB layouts and enclosures.

Maximum Clock Frequency: 3.3 MHz

High clock frequency allows for fast processing of instructions and data.

Length: 23.94 mm

Balance of length and width dimensions for space-efficient PCB design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high-performance computing capabilities for diverse applications.

RAM Bytes: 512

Adequate RAM capacity for storing and accessing data during processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing efficiency.

Terminal Form: J BEND

J bend terminals ensure secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with most electronic systems.

ROM Programmability: UVPROM

UVPROM technology allows for easy and secure programming of ROM contents.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and components.

Speed: 3.3 rpm

Operates at a speed suitable for various real-time processing applications.

No. of I/O Lines: 14

Sufficient I/O lines for interfacing with external devices or peripherals, enhancing versatility.

Technical Specifications

Microcontrollers PMS430E315FZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-CQCC-J68

Length:

23.94 mm

No. of I/O Lines:

14

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

UVPROM

Maximum Seated Height:

4.57 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23.94 mm

Peripheral IC Type:

Trade Compliance

PMS430E315FZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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