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PMS430E325AFZ

Texas Instruments

PMS430E325AFZ by Texas Instruments

PMS430E325AFZ by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 512 RAM bytes, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a temperature range of -40 to 85 °C, this chip carrier package offers 14 I/O lines and ADC channels for versatile connectivity.

Median Price

$90.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54 parts In-Stock

1+ parts

$90.950

100+ parts

$89.140

1k+ parts

$87.320

10k+ parts

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54

$90.950

$89.140

$87.320

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Distributors (In-Stock)

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Vyrian

USA . 9,254 parts In-Stock

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Digiode

USA . 4,908 parts In-Stock

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4,908

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Distributors (Availability)

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One Stop Electronics

USA . 1,066 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 535 parts In-Stock

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$7.656

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535

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Parana Technologies

USA . 872 parts In-Stock

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$16.473

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$16.766

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872

$16.473

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$16.766

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DigiPath Technology Company

USA . 1,440 parts In-Stock

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$18.139

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$16.688

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1,440

$18.139

$16.688

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$18.509

100+ parts

$17.584

1k+ parts

$16.658

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2,285

$18.509

$17.584

$16.658

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ChromeModa Solutions

Germany . 2,179 parts In-Stock

1+ parts

$18.509

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$15.177

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Corphita

USA . 1,901 parts In-Stock

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Microchip USA

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Assy Fe

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Overview

Unlock the power of innovation with the Texas Instruments PMS430E325AFZ microcontroller. Crafted with precision and expertise by a renowned manufacturer, this advanced chip offers endless possibilities for your projects. From smart devices to industrial automation, this versatile microcontroller delivers unmatched performance and reliability. Experience seamless integration and enhanced functionality with the PMS430E325AFZ, setting new standards in the world of microcontrollers. Elevate your designs and unleash your creativity with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for industrial applications.

Surface Mount: YES

Ease of assembly and space-saving design for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Wide operating voltage range provides flexibility in power supply selection.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, suitable for advanced applications.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies increases versatility for different system requirements.

No. of Terminals: 68

Sufficient terminals for connecting to peripherals and external components, enabling elaborate system integration.

Package Style (Meter): CHIP CARRIER

Chip carrier package offers compact size and efficient heat dissipation for improved performance.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments, ideal for industrial settings.

ROM Words: 16384

Large ROM capacity enables storing of extensive program codes and data for complex functionalities.

RAM Bytes: 512

Adequate RAM size for temporary data storage and efficient program execution, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliability.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies power management and compatibility with existing systems.

ROM Programmability: OTPROM

One-Time Programmable ROM allows for secure and permanent storage of critical data and program codes.

No. of I/O Lines: 14

Sufficient input/output lines for external communication and interfacing with other devices, enhancing connectivity options.

Technical Specifications

Microcontrollers PMS430E325AFZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-CQCC-J68

No. of I/O Lines:

14

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

PMS430E325AFZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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