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PMS430E337AHFD

Texas Instruments

PMS430E337AHFD by Texas Instruments

PMS430E337AHFD by Texas Instruments is a 16-bit microcontroller with 32768 ROM words and 1024 RAM bytes. It operates at a max clock frequency of 3.8 MHz, suitable for industrial applications requiring PWM control and ADC channels. With a temperature range from -40 to 85 °C, it offers high performance in compact flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,494 parts In-Stock

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9,494

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Digiode

USA . 2,233 parts In-Stock

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2,233

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Distributors (Availability)

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$15.408

100+ parts

-

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789

$15.408

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One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$33.000

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-

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471

$33.000

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Parana Technologies

USA . 361 parts In-Stock

1+ parts

$46.596

100+ parts

$4,327.141

1k+ parts

$41.936

10k+ parts

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361

$46.596

$4,327.141

$41.936

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DigiPath Technology Company

USA . 2,060 parts In-Stock

1+ parts

$51.308

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2,060

$51.308

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ChromeModa Solutions

Germany . 766 parts In-Stock

1+ parts

$52.355

100+ parts

$42.931

1k+ parts

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766

$52.355

$42.931

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IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$52.355

100+ parts

$49.737

1k+ parts

$47.120

10k+ parts

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523

$52.355

$49.737

$47.120

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Corphita

USA . 4,607 parts In-Stock

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4,607

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Microchip USA

USA . 125 parts In-Stock

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125

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Overview

Experience the superior quality and performance of the PMS430E337AHFD microcontroller by Texas Instruments. With a reputation for excellence in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Trust Texas Instruments to provide you with a reliable and innovative solution for your project needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy installation and compact PCB design, saving space in electronic devices.

Maximum Supply Voltage: 5.5 V

Allows for a higher voltage input range, suitable for a wide range of applications.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting on the PCB, optimizing space utilization.

Bit Size: 16

Offers high computational capabilities and processing power for complex tasks.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, providing flexibility in system design.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK

Enables easy integration into electronic devices and enhances the overall aesthetic appeal.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even at lower supply voltages, increasing the reliability of the product.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where the microcontroller may be subjected to higher operating temperatures.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments without performance degradation.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

Facilitates easy routing and soldering of connections, simplifying the manufacturing process.

ROM Words: 32768

Provides a sizable memory capacity for storing program instructions and data.

Maximum Seated Height: 4.25 mm

Low-profile design ideal for applications with space constraints or compact electronic devices.

Width: 14 mm

Compact form factor suitable for smaller PCB layouts and designs.

Maximum Clock Frequency: 3.8 MHz

Offers high-speed processing capabilities for efficient execution of instructions and tasks.

Length: 20 mm

Optimal size for fitting within standard PCB dimensions while maintaining functionality.

Temperature Grade: INDUSTRIAL

Designed to meet the reliability and durability requirements of industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and control functions.

RAM Bytes: 1024

Provides sufficient random access memory for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Facilitates easy soldering and assembly of the microcontroller on the PCB, reducing manufacturing time.

Nominal Supply Voltage: 5 V

Standard voltage level compatible with many electronic devices and power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog signals and motor speed.

ROM Programmability: UVPROM

Programmable ROM provides flexibility for updating firmware and software configurations.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density mounting, suitable for compact PCB designs.

Speed: 3.8 rpm

Operates at a high speed of 3.8 rotations per minute, ensuring efficient task execution.

No. of I/O Lines: 46

Offers a sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers PMS430E337AHFD attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5 TO 5.5V SUPPLY

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-GQFP-G100

Length:

20 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

UVPROM

Maximum Seated Height:

4.25 mm

Speed:

3.8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PMS430E337AHFD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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