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PMS430E337HFD

Texas Instruments

PMS430E337HFD by Texas Instruments

PMS430E337HFD by Texas Instruments is a 16-bit microcontroller with 40 I/O lines, operating at a max clock frequency of 3.8 MHz. It features ADC and PWM channels, suitable for applications requiring low power consumption and precise analog-to-digital conversion. This rectangular flatpack package offers a compact design with terminal pitch of 0.65 mm, making it ideal for space-constrained projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,058 parts In-Stock

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3,058

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Digiode

USA . 2,566 parts In-Stock

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2,566

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 607 parts In-Stock

1+ parts

$18.738

100+ parts

-

1k+ parts

$18.830

10k+ parts

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607

$18.738

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$18.830

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$18.900

100+ parts

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672

$18.900

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DigiPath Technology Company

USA . 271 parts In-Stock

1+ parts

$20.633

100+ parts

$18.982

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271

$20.633

$18.982

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ChromeModa Solutions

Germany . 5,242 parts In-Stock

1+ parts

$21.054

100+ parts

$17.264

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5,242

$21.054

$17.264

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IDEA Electronic Components Group

UK . 683 parts In-Stock

1+ parts

$21.054

100+ parts

$20.001

1k+ parts

$18.949

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683

$21.054

$20.001

$18.949

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One Stop Electronics

USA . 305 parts In-Stock

1+ parts

$35.000

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305

$35.000

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Corphita

USA . 2,642 parts In-Stock

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2,642

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Overview

Upgrade your electronic projects with the Texas Instruments PMS430E337HFD microcontroller! Manufactured by a trusted brand, this 16-bit device offers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value and benefits. Experience seamless performance and precision with the PMS430E337HFD, designed to meet all your project needs. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient assembly onto printed circuit boards, reducing production time and cost.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different power requirements.

Bit Size: 16

Offers a good balance between computational power and memory efficiency for many embedded applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external devices and sensors.

Package Shape: RECTANGULAR

Facilitates efficient utilization of space on circuit boards, optimizing layout and design.

Minimum Supply Voltage: 3 V

Allows for operation in low-power scenarios, increasing energy efficiency and extending battery life.

ADC Channels: YES

Enables analog-to-digital conversion, essential for reading data from sensors and other analog sources.

Terminal Position: QUAD

Offers a standardized terminal arrangement for easy integration into existing board designs.

Maximum Seated Height: 4.25 mm

Provides a low-profile form factor, ideal for space-constrained applications and compact devices.

Width: 14 mm

Compact width allows for efficient placement on circuit boards without wasting valuable space.

Maximum Clock Frequency: 3.8 MHz

Offers sufficient processing speed for a wide range of real-time applications and control systems.

Length: 19.7 mm

Balances compactness with functionality, suitable for embedding in various electronic devices.

Peripheral IC Type: MICROCONTROLLER

Combines multiple functions in a single chip, reducing the need for external components and simplifying design.

Technology: CMOS

Provides low power consumption and high noise immunity, enhancing overall reliability and efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and rework, making assembly and maintenance of the microcontroller hassle-free.

Nominal Supply Voltage: 5 V

Complies with common voltage standards, ensuring compatibility with a wide range of power sources.

PWM Channels: YES

Supports pulse-width modulation, essential for controlling motor speeds, LED brightness, and other analog functions.

ROM Programmability: OTPROM

Allows for one-time programmability of read-only memory, ensuring data integrity and security in embedded systems.

Terminal Pitch: 0.65 mm

Provides a fine pitch for terminals, enabling high-density mounting and compact board layouts.

No. of I/O Lines: 40

Offers a generous number of input/output lines for bidirectional communication and data exchange with external devices.

Technical Specifications

Microcontrollers PMS430E337HFD attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

Length:

19.7 mm

No. of I/O Lines:

40

No. of Terminals:

100

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

OTPROM

Maximum Seated Height:

4.25 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PMS430E337HFD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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