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PDAC37J82IAAV

Texas Instruments

PDAC37J82IAAV by Texas Instruments

Texas Instruments' PDAC37J82IAAV is a 16-bit D/A converter with 0.6V max analog output voltage. Ideal for industrial applications, it features a 0.01us nominal settling time and operates b/w -40 to 85°C. With a compact square package style and surface mount capability, this device offers precise digital-to-analog conversion in a wide temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,110 parts In-Stock

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3,110

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Digiode

USA . 1,582 parts In-Stock

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1,582

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 369 parts In-Stock

1+ parts

$8.999

100+ parts

-

1k+ parts

$9.667

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369

$8.999

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$9.667

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ChromeModa Solutions

Germany . 5,485 parts In-Stock

1+ parts

$10.111

100+ parts

$8.291

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$10.111

$8.291

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IDEA Electronic Components Group

UK . 464 parts In-Stock

1+ parts

$10.111

100+ parts

$9.605

1k+ parts

$9.100

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464

$10.111

$9.605

$9.100

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AZTECH Wire

Italy . 595 parts In-Stock

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$16.007

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595

$16.007

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One Stop Electronics

USA . 1,232 parts In-Stock

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$29.000

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$29.000

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Corphita

USA . 4,828 parts In-Stock

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4,828

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DigiPath Technology Company

USA . 1,086 parts In-Stock

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$9.116

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1,086

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$9.116

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Overview

Unlock the power of precision with the Texas Instruments PDAC37J82IAAV digital-to-analog converter. Crafted by a trusted manufacturer known for quality, this converter delivers unparalleled performance in a compact package. Ideal for a range of applications, this product offers customers value and benefits like never before. Experience seamless integration, fast settling times, and reliable output voltage control with the PDAC37J82IAAV. Elevate your projects to new heights with this top-of-the-line converter.

Feature Benefit Bullets

Maximum Analog Output Voltage: 0.6 V

Provides a high maximum analog output voltage, allowing for a wide range of output signal levels.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers a good balance between durability and cost-effectiveness.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Bits: 16

With 16 bits, this digital-to-analog converter offers high resolution and accuracy in converting digital signals to analog.

Nominal Settling Time: 0.01 us

The low settling time ensures that the output voltage stabilizes quickly after a change in input signal, making it suitable for fast-paced applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions without compromising performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this converter is compatible with many common power sources, making it versatile.

Technical Specifications

Digital-to-Analog Converters PDAC37J82IAAV attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Nominal Settling Time (tstl):

10 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

.6 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

144

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Trade Compliance

PDAC37J82IAAV Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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