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PDAC38RF82AAV

Texas Instruments

PDAC38RF82AAV by Texas Instruments

PDAC38RF82AAV by Texas Instruments is a 14-bit D/A converter with a max analog output voltage of 2.3 V and min of 1.3 V. It features a nominal settling time of 0.001 us, making it ideal for industrial applications requiring precise analog signal generation in a compact square package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,002 parts In-Stock

1+ parts

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4,002

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Vyrian

USA . 2,855 parts In-Stock

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2,855

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$5.463

100+ parts

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819

$5.463

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Parana Technologies

USA . 671 parts In-Stock

1+ parts

$8.365

100+ parts

-

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$8.994

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671

$8.365

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$8.994

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DigiPath Technology Company

USA . 929 parts In-Stock

1+ parts

$9.211

100+ parts

$8.474

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929

$9.211

$8.474

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ChromeModa Solutions

Germany . 5,769 parts In-Stock

1+ parts

$9.399

100+ parts

$7.707

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5,769

$9.399

$7.707

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

1+ parts

$9.399

100+ parts

$8.929

1k+ parts

$8.459

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2,362

$9.399

$8.929

$8.459

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One Stop Electronics

USA . 1,540 parts In-Stock

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$24.000

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1,540

$24.000

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Corphita

USA . 4,695 parts In-Stock

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4,695

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Overview

Discover the innovative PDAC38RF82AAV by Texas Instruments, a top-tier manufacturer known for cutting-edge technology in the category of Digital-to-Analog Converters. This product offers unparalleled quality and precision, making it ideal for a wide range of applications. With a maximum analog output voltage of 2.3V and a nominal settling time of 0.001us, this converter provides exceptional performance and reliability. Experience the value and benefits of Texas Instruments' expertise with the PDAC38RF82AAV, delivering superior results for your digital-to-analog conversion needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.3 V

Higher maximum analog output voltage allows for accurate and precise conversion of digital signals to analog signals, providing high fidelity output.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuit boards, saving space and facilitating mass production.

No. of Bits: 14

With 14 bits, the digital-to-analog converter can provide a high resolution and accurate conversion of digital values to analog signals.

Nominal Operating Temperature: -40 to 85 °C

Wide operating temperature range makes the product suitable for industrial applications where temperature variations are common.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures power efficiency and compatibility with a wide range of electronic devices.

Technical Specifications

Digital-to-Analog Converters PDAC38RF82AAV attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

1 ns

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

1.3 V

Maximum Analog Output Voltage:

2.3 V

Nominal Negative Supply Voltage:

-1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

144

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Fine Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

Trade Compliance

PDAC38RF82AAV Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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