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PDAC3482IRKDT

Texas Instruments

PDAC3482IRKDT by Texas Instruments

Texas Instruments PDAC3482IRKDT is a 16-bit D/A converter with 0.6V max analog output voltage. It operates in industrial temperature range (-40 to 85 °C) and supports serial, parallel, and word input formats. Ideal for applications requiring precise analog signal generation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,025 parts In-Stock

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7,025

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Digiode

USA . 766 parts In-Stock

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766

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 308 parts In-Stock

1+ parts

$11.387

100+ parts

-

1k+ parts

$11.809

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308

$11.387

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$11.809

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DigiPath Technology Company

USA . 1,311 parts In-Stock

1+ parts

$12.538

100+ parts

$11.535

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1,311

$12.538

$11.535

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

1+ parts

$12.794

100+ parts

$12.154

1k+ parts

$11.515

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1,561

$12.794

$12.154

$11.515

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ChromeModa Solutions

Germany . 1,092 parts In-Stock

1+ parts

$12.794

100+ parts

$10.491

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1,092

$12.794

$10.491

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$16.552

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799

$16.552

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One Stop Electronics

USA . 504 parts In-Stock

1+ parts

$27.000

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504

$27.000

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Corphita

USA . 2,663 parts In-Stock

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2,663

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ChipstoGo Electronic ltd

UK . 37 parts In-Stock

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Overview

Elevate your digital-to-analog conversion experience with the cutting-edge PDAC3482IRKDT by Texas Instruments. Crafted with precision and expertise, this converter delivers unparalleled quality and reliability in a compact square package. Perfect for industrial applications, this converter offers seamless integration with a nominal supply voltage of 3.3V and a maximum analog output voltage of 0.6V. Experience lightning-fast response times and crystal-clear output signals with the PDAC3482IRKDT, setting a new standard in the world of digital-to-analog converters. Upgrade your systems today with Texas Instruments' exceptional technology.

Feature Benefit Bullets

Maximum Analog Output Voltage: 0.6 V

Provides a wide analog output range for more flexibility in signal processing.

Package Body Material: PLASTIC/EPOXY

Offers a durable and lightweight construction for ease of handling and installation.

Surface Mount: YES

Allows for easy integration into circuit boards, saving space and reducing assembly time.

No. of Bits: 16

Enables high resolution and accuracy in analog signal conversion.

Nominal Settling Time (tstl): 0.01 us

Ensures fast and efficient settling time for accurate analog output.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require reliable operation under varying temperature conditions.

Nominal Supply Voltage: 3.3 V

Works efficiently with a commonly used supply voltage, making it compatible with many systems.

Technical Specifications

Digital-to-Analog Converters PDAC3482IRKDT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial, Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

.6 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

88

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.024 in (0.6 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N88

Trade Compliance

PDAC3482IRKDT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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