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PDAC11001APFBT

Texas Instruments

PDAC11001APFBT by Texas Instruments

Texas Instruments' PDAC11001APFBT is a 20-bit D/A converter with 0.0004% max linearity error. It features a flatpack, thin profile package style and operates in automotive temperature grade. Ideal for applications requiring precise analog signal conversion with fast settling time of 2.5 us.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,344 parts In-Stock

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8,344

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Digiode

USA . 3,820 parts In-Stock

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3,820

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$14.277

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69

$14.277

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AZTECH Wire

Italy . 646 parts In-Stock

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$16.670

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646

$16.670

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Parana Technologies

USA . 2,266 parts In-Stock

1+ parts

$18.826

100+ parts

$1,748.295

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$16.944

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2,266

$18.826

$1,748.295

$16.944

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DigiPath Technology Company

USA . 1,502 parts In-Stock

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$20.730

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1,502

$20.730

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ChromeModa Solutions

Germany . 2,211 parts In-Stock

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$21.153

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$17.345

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2,211

$21.153

$17.345

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IDEA Electronic Components Group

UK . 439 parts In-Stock

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$21.153

100+ parts

$20.095

1k+ parts

$19.038

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439

$21.153

$20.095

$19.038

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$29.000

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669

$29.000

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One Stop Electronics

USA . 1,293 parts In-Stock

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$34.000

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$34.000

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Continental Prestige Electronics

USA . 4,204 parts In-Stock

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Argo Parts USA

USA . 2,055 parts In-Stock

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Corphita

USA . 1,835 parts In-Stock

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1,835

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unlock endless possibilities with the PDAC11001APFBT by Texas Instruments. Crafted with precision and expertise, this digital-to-analog converter offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance, accuracy, and efficiency. Experience seamless integration, enhanced functionality, and superior results with this innovative solution. Elevate your projects to new heights with the PDAC11001APFBT – where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

No. of Bits: 20

With 20 bits, the converter can provide high resolution and accuracy in converting digital signals to analog, suitable for applications requiring precise voltage output.

Nominal Settling Time (tstl): 2.5 us

The low settling time ensures quick and accurate conversion, making it suitable for applications that require fast response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to be used in harsh environments without compromising performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, the product meets specific temperature requirements and reliability standards for automotive applications.

Nominal Supply Voltage: 15 V

The 15V supply voltage provides flexibility in powering the converter, making it compatible with a wide range of systems.

Technical Specifications

Digital-to-Analog Converters PDAC11001APFBT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0004 %

Nominal Settling Time (tstl):

2.5 µs

No. of Bits:

20

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Trade Compliance

PDAC11001APFBT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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