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PDAC53204RTET

Texas Instruments

PDAC53204RTET by Texas Instruments

Texas Instruments' PDAC53204RTET is a 10-bit D/A converter with max output voltage of 5.5V and settling time of 20us. Ideal for applications requiring high precision analog signal generation in compact spaces due to its small form factor and low linearity error.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,470 parts In-Stock

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4,470

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Digiode

USA . 3,833 parts In-Stock

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3,833

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Distributors (Availability)

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AZTECH Wire

Italy . 461 parts In-Stock

1+ parts

$8.170

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461

$8.170

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One Stop Electronics

USA . 407 parts In-Stock

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$19.000

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407

$19.000

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Parana Technologies

USA . 1,435 parts In-Stock

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$24.598

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$25.263

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1,435

$24.598

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$25.263

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DigiPath Technology Company

USA . 1,226 parts In-Stock

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$27.085

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1,226

$27.085

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ChromeModa Solutions

Germany . 4,300 parts In-Stock

1+ parts

$27.638

100+ parts

$22.663

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4,300

$27.638

$22.663

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IDEA Electronic Components Group

UK . 488 parts In-Stock

1+ parts

$27.638

100+ parts

$26.256

1k+ parts

$24.874

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488

$27.638

$26.256

$24.874

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Microchip USA

USA . 4,746 parts In-Stock

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Corphita

USA . 1,521 parts In-Stock

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1,521

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Overview

Discover the power of precision with the PDAC53204RTET from Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Digital-to-Analog Converter, this product offers unparalleled quality and reliability in converting digital signals to analog output voltage up to 5.5V. Ideal for a wide range of applications, this converter boasts a nominal settling time of just 20us, ensuring fast and accurate performance. With a compact package style and advanced features like a nickel palladium gold finish, this converter delivers exceptional value, providing customers with superior results and unmatched benefits. Elevate your projects with the PDAC53204RTET and experience the difference today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Higher maximum analog output voltage allows for greater flexibility in output signal range.

No. of Bits: 10

10 bits resolution provides a high level of accuracy in converting digital signals to analog.

Maximum Linearity Error (EL): 0.09765%

Low linearity error ensures accurate conversion and faithful reproduction of input signal.

Nominal Settling Time (tstl): 20 us

Fast settling time allows for quick response to changes in input signal.

Sample Rate: 0.25 MHz

High sample rate enables smooth and continuous conversion of digital signals.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures efficient power consumption.

Technical Specifications

Digital-to-Analog Converters PDAC53204RTET attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.09765 %

Nominal Settling Time (tstl):

20 µs

Sample Rate:

250 kHz

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Standards and Codes

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Trade Compliance

PDAC53204RTET Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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