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PDAC3484IRKDT

Texas Instruments

PDAC3484IRKDT by Texas Instruments

Texas Instruments' PDAC3484IRKDT is a 16-bit D/A converter with 0.6V max analog output voltage. Ideal for industrial applications, it features a settling time of 0.01us and operates b/w -40 to 85°C. With a compact square package style and 88 terminals, this chip carrier is surface mountable and supports serial, parallel, and word input formats.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,723 parts In-Stock

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Digiode

USA . 1,563 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$7.671

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462

$7.671

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Parana Technologies

USA . 609 parts In-Stock

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$10.019

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$10.577

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609

$10.019

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DigiPath Technology Company

USA . 1,163 parts In-Stock

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$11.032

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$10.149

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1,163

$11.032

$10.149

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ChromeModa Solutions

Germany . 5,563 parts In-Stock

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$11.257

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$9.231

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5,563

$11.257

$9.231

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IDEA Electronic Components Group

UK . 587 parts In-Stock

1+ parts

$11.257

100+ parts

$10.694

1k+ parts

$10.131

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587

$11.257

$10.694

$10.131

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One Stop Electronics

USA . 901 parts In-Stock

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$32.000

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901

$32.000

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Corphita

USA . 3,891 parts In-Stock

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Overview

Unlock a world of precise digital-to-analog conversion with the Texas Instruments PDAC3484IRKDT. Crafted by industry leader Texas Instruments, this cutting-edge converter offers unparalleled quality and reliability. Perfect for industrial applications, this converter delivers a maximum analog output voltage of 0.6V with lightning-fast settling time of just 0.01us. With its innovative design and superior performance, the PDAC3484IRKDT provides customers with unmatched value and benefits for all their digital-to-analog conversion needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 0.6 V

Provides a high maximum analog output voltage, ideal for applications requiring precise voltage output.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and ruggedness to the product.

Surface Mount: YES

Ease of installation and space-saving design due to the surface mount capability.

No. of Bits: 16

Offers a high resolution of 16 bits, ensuring accurate conversion from digital to analog signals.

No. of Terminals: 88

Provides multiple terminals for a wide range of connectivity options.

Nominal Settling Time (tstl): 0.01 us

Fast settling time ensures quick and accurate signal processing.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments up to 85°C.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures as low as -40°C.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, suitable for a wide range of applications.

Input Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in input bit coding, catering to different system requirements.

Technical Specifications

Digital-to-Analog Converters PDAC3484IRKDT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial, Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

.6 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

88

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.024 in (0.6 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N88

Trade Compliance

PDAC3484IRKDT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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