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PDAC12DL3200ACF

Texas Instruments

PDAC12DL3200ACF by Texas Instruments

Texas Instruments' PDAC12DL3200ACF is a 12-bit D/A converter with max analog output voltage of 2.3V and linearity error of 0.0244%. Ideal for industrial applications, it operates b/w -40 to 85°C, has 256 terminals in a square package shape, and supports parallel input format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,816 parts In-Stock

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Digiode

USA . 4,801 parts In-Stock

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4,801

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Distributors (Availability)

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$5.134

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368

$5.134

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Parana Technologies

USA . 1,572 parts In-Stock

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$21.209

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$21.505

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$21.209

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$21.505

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DigiPath Technology Company

USA . 1,652 parts In-Stock

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$23.353

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$23.353

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ChromeModa Solutions

Germany . 4,645 parts In-Stock

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$23.830

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$19.541

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4,645

$23.830

$19.541

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IDEA Electronic Components Group

UK . 642 parts In-Stock

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$23.830

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$22.638

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$21.447

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642

$23.830

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$21.447

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One Stop Electronics

USA . 781 parts In-Stock

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$29.000

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781

$29.000

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Corphita

USA . 4,749 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments PDAC12DL3200ACF Digital-to-Analog Converter. Crafted by a trusted industry leader, this cutting-edge technology delivers unparalleled performance in a wide range of applications. Experience enhanced accuracy and efficiency with its advanced features and robust construction. Elevate your projects to new heights with the value and reliability that only Texas Instruments can provide.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.3 V

Provides a high maximum output voltage, allowing for a wide range of analog signal outputs.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors.

Surface Mount: YES

Facilitates easy and convenient installation on printed circuit boards.

No. of Bits: 12

Offers a high resolution for accurate conversion of digital signals to analog.

Maximum Linearity Error (EL): 0.0244%

Provides high accuracy in analog signal output, reducing errors and improving performance.

No. of Terminals: 256

Offers a large number of terminals for versatile connectivity options.

Package Style (Meter): GRID ARRAY

Grid array package style allows for efficient packing of components and space-saving design.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to function at low temperatures, making it suitable for a wide range of environments.

Width: 17 mm

Compact width size for easy integration into various electronic systems.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage ensures reliable and consistent performance.

Technical Specifications

Digital-to-Analog Converters PDAC12DL3200ACF attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

2's Complement Binary

Maximum Linearity Error (EL):

0.0244 %

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

1.3 V

Maximum Analog Output Voltage:

2.3 V

Nominal Negative Supply Voltage:

-1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

256

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.039 in (1 mm)

Surface Mount:

Yes

Width:

0.669 in (17 mm)

Length:

0.669 in (17 mm)

Maximum Seated Height:

0.13 in (3.31 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,39

Standards and Codes

JESD-30 Code:

S-PBGA-B256

Trade Compliance

PDAC12DL3200ACF Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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