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DAC8814IBDBTG4

Texas Instruments

DAC8814IBDBTG4 by Texas Instruments

DAC8814IBDBTG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of ±10 V, settling time of 0.5 us, and linearity error of 0.0061%. Ideal for industrial applications requiring high precision and fast response times.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,674 parts In-Stock

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5,674

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Digiode

USA . 683 parts In-Stock

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683

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Distributors (Availability)

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Parana Technologies

USA . 452 parts In-Stock

1+ parts

$5.375

100+ parts

-

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$6.056

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452

$5.375

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$6.056

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ChromeModa Solutions

Germany . 3,370 parts In-Stock

1+ parts

$6.039

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$4.952

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$6.039

$4.952

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IDEA Electronic Components Group

UK . 1,023 parts In-Stock

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$6.039

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$5.435

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$6.039

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Semicontronic

India . 207 parts In-Stock

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$8.000

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$7.800

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$7.760

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207

$8.000

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$7.760

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AZTECH Wire

Italy . 198 parts In-Stock

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$17.357

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$17.357

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$25.123

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$23.867

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$23.867

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870

$25.123

$23.867

$23.867

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Corohmni

South Africa . 60 parts In-Stock

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$27.366

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60

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Ampacity Inc.

Singapore . 755 parts In-Stock

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$31.000

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$31.000

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One Stop Electronics

USA . 318 parts In-Stock

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$33.000

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Continental Prestige Electronics

USA . 5,138 parts In-Stock

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Corphita

USA . 4,059 parts In-Stock

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Microchip USA

USA . 2,937 parts In-Stock

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DigiPath Technology Company

USA . 1,928 parts In-Stock

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$5.445

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$5.445

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Argo Parts USA

USA . 1,792 parts In-Stock

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Bastille Electronics

Australia . 27 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the DAC8814IBDBTG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments delivers cutting-edge technology that guarantees top-notch performance in a variety of applications. From industrial automation to telecommunications, this small outline converter offers a quick settling time of just 0.5 us and boasts an impressive linearity error of only 0.0061%. With a nominal supply voltage of 5V and low supply current, this high-quality product ensures optimal efficiency and accuracy in your projects. Trust Texas Instruments to elevate your designs to the next level with the DAC8814IBDBTG4.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

Provides a high maximum voltage output, allowing for a wide dynamic range and versatility in signal processing applications.

No. of Bits: 16

High resolution due to 16-bit conversion, resulting in more accurate analog signal representation.

Maximum Settling Time: 0.5 us

Fast settling time ensures quick and accurate conversion, important for real-time applications.

Package Style: SMALL OUTLINE, SHRINK PITCH

Compact and efficient package design for space-saving and ease of integration into electronic systems.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range (-40 to 85°C), ensuring reliability and performance in harsh conditions.

Sample Rate: 2 MHz

High sample rate allows for rapid conversion of digital signals to analog, making it ideal for high-speed data transmission and processing.

Technical Specifications

Digital-to-Analog Converters DAC8814IBDBTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

500 ns

Maximum Supply Current:

5 μA

Maximum Settling Time:

500 ns

Sample Rate:

2 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC8814IBDBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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