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DAC7725UB/1KG4

Texas Instruments

DAC7725UB/1KG4 by Texas Instruments

DAC7725UB/1KG4 by Texas Instruments is a 12-bit D/A converter with 10 us settling time, 0.0244% linearity error, and 0.1 MHz sample rate. Ideal for industrial applications requiring precise analog output voltage up to ±10 V in a compact rectangular package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,230 parts In-Stock

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Vyrian

USA . 4,293 parts In-Stock

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4,293

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Digiode

USA . 1,985 parts In-Stock

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1,985

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Semicontronic

India . 745 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

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-

745

$8.000

$7.800

$7.760

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Parana Technologies

USA . 311 parts In-Stock

1+ parts

$9.923

100+ parts

$921.465

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$8.930

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311

$9.923

$921.465

$8.930

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DigiPath Technology Company

USA . 2,118 parts In-Stock

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$10.926

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$10.926

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One Stop Electronics

USA . 1,462 parts In-Stock

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$11.000

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$11.000

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ChromeModa Solutions

Germany . 1,758 parts In-Stock

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$11.149

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$9.142

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$11.149

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IDEA Electronic Components Group

UK . 907 parts In-Stock

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$11.149

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$10.592

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$10.034

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907

$11.149

$10.592

$10.034

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AZTECH Wire

Italy . 358 parts In-Stock

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$11.313

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Corohmni

South Africa . 312 parts In-Stock

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$19.988

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$23.540

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$22.363

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$22.363

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$23.540

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Continental Prestige Electronics

USA . 4,054 parts In-Stock

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Argo Parts USA

USA . 2,472 parts In-Stock

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Corphita

USA . 2,242 parts In-Stock

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Microchip USA

USA . 1,109 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience unparalleled precision and reliability with the DAC7725UB/1KG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality digital-to-analog converters for a wide range of applications. Whether you're in industrial automation, telecommunications, or automotive, this product offers exceptional value with its high performance and versatility. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the DAC7725UB/1KG4 today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

High maximum analog output voltage allows for greater flexibility and precision in signal processing applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

No. of Functions: 1

Single function design simplifies the product's operation and integration into existing systems.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and alignment in circuit designs.

No. of Bits: 12

12-bit resolution ensures high accuracy and precision in converting digital signals to analog output.

Maximum Settling Time: 10 us

Fast settling time ensures minimal delay and distortion in signal conversion.

Maximum Linearity Error (EL): 0.0244%

Low linearity error guarantees accurate output voltage representation of the input digital signal.

Power Supplies (V): 5, 15/+-15

Supports a wide range of power supply voltages, increasing compatibility with different systems.

No. of Terminals: 28

Ample terminals provide versatility in connectivity and circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs.

Nominal Settling Time (tstl): 10 us

Consistent settling time ensures reliable and stable analog output.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Reliable terminal finish ensures long-term durability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and design options.

Maximum Seated Height: 2.65 mm

Low seated height profile saves space and allows for compact system design.

Width: 7.5 mm

Narrow width footprint is ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes heat exposure and prevents damage to the components during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands the rigorous soldering process without compromising product integrity.

Minimum Analog Output Voltage: -10 V

Support for negative analog output voltage enables bidirectional signal processing capabilities.

Length: 17.9 mm

Moderate length offers a balance between compact size and ease of handling during assembly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding operational environments.

Sample Rate: 0.1 MHz

High sample rate allows for rapid and accurate signal conversion for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and enhances mechanical stability.

Maximum Supply Current: 8.5 mA

Low supply current consumption minimizes power usage and extends battery life in portable devices.

Input Format: PARALLEL, WORD

Supports multiple input formats for compatibility with different digital signal sources.

Converter Type: D/A CONVERTER

Digital-to-analog converter type enables seamless conversion of digital signals to analog output.

Nominal Supply Voltage: 15 V

Nominal supply voltage ensures stable and consistent operation within the specified voltage range.

Nominal Negative Supply Voltage: -15 V

Negative supply voltage support allows for versatile signal processing capabilities.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and facilitates easy connection.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the product's resistance to moisture-related damage during storage and handling.

Input Bit Code: BINARY

Binary input bit code simplifies signal processing and conversion for ease of use and compatibility.

Technical Specifications

Digital-to-Analog Converters DAC7725UB/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

8.5 mA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,15/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC7725UB/1KG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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