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PDAC60501MDQFT

Texas Instruments

PDAC60501MDQFT by Texas Instruments

Texas Instruments' PDAC60501MDQFT is a 12-bit D/A converter with max analog output voltage of 5.5V and linearity error of 0.0244%. Ideal for automotive applications, it has a small outline package with very thin profile and operates in temperatures ranging from -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,998 parts In-Stock

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Vyrian

USA . 3,192 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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One Stop Electronics

USA . 616 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 354 parts In-Stock

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$7.877

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Semicontronic

India . 795 parts In-Stock

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$15.000

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$14.625

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$14.550

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Parana Technologies

USA . 1,795 parts In-Stock

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$17.475

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$17.669

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$17.475

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Corohmni

South Africa . 349 parts In-Stock

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$18.082

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DigiPath Technology Company

USA . 1,598 parts In-Stock

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$19.242

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ChromeModa Solutions

Germany . 2,388 parts In-Stock

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$19.635

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$16.101

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IDEA Electronic Components Group

UK . 1,628 parts In-Stock

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$19.635

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$18.653

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$17.672

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Ampacity Inc.

Singapore . 1,368 parts In-Stock

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$20.000

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Continental Prestige Electronics

USA . 3,872 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Argo Parts USA

USA . 696 parts In-Stock

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Corphita

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Overview

Experience the precision and reliability of Texas Instruments with the PDAC60501MDQFT digital-to-analog converter. Perfect for automotive applications, this high-quality product offers a maximum analog output voltage of 5.5V and a nominal settling time of just 5us. With its small outline and heat sink profile, this converter is ideal for space-constrained designs. Trust in Texas Instruments for superior performance and value in your next project.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Higher maximum output voltage allows for a wider range of analog signals to be accurately reproduced, making this product suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability while keeping the overall weight of the product low.

Surface Mount: YES

Surface mount compatibility allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 12

With a higher number of bits, this digital-to-analog converter can provide more precise and accurate analog output signals.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures that the output closely matches the input, resulting in high accuracy in signal conversion.

Nominal Settling Time (tstl): 5 us

Fast settling time enables quick stabilization of the output signal, making this product ideal for applications that require rapid response times.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this digital-to-analog converter can withstand harsh operating conditions and temperature fluctuations.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product is essential for converting digital signals from microcontrollers or processors into analog signals for various applications.

Technical Specifications

Digital-to-Analog Converters PDAC60501MDQFT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.079 in (2 mm)

Length:

0.079 in (2 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N8

Trade Compliance

PDAC60501MDQFT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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