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DAC7731EC/1KG4

Texas Instruments

DAC7731EC/1KG4 by Texas Instruments

DAC7731EC/1KG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of ±10 V. It operates in industrial temperature range (-40 to 85°C) and has settling time of 5 us. Ideal for applications requiring precise analog signal generation in compact spaces, it features small outline package with dual gull wing terminals.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 3,667 parts In-Stock

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Vyrian

USA . 3,188 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 160 parts In-Stock

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$10.000

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160

$10.000

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Parana Technologies

USA . 1,381 parts In-Stock

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$10.773

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$11.256

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$10.773

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Corohmni

South Africa . 528 parts In-Stock

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$11.063

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528

$11.063

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$11.862

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$10.913

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$11.862

$10.913

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Semicontronic

India . 930 parts In-Stock

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$12.000

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$11.700

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$11.640

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930

$12.000

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$11.640

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ChromeModa Solutions

Germany . 6,056 parts In-Stock

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$12.104

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$9.925

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$12.104

$9.925

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IDEA Electronic Components Group

UK . 698 parts In-Stock

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$12.104

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$11.499

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$10.894

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AZTECH Wire

Italy . 848 parts In-Stock

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$15.565

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One Stop Electronics

USA . 1,531 parts In-Stock

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$24.000

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$24.000

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$25.570

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$24.291

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$24.291

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Continental Prestige Electronics

USA . 5,337 parts In-Stock

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Argo Parts USA

USA . 2,593 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

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Overview

Enhance your electronic designs with the DAC7731EC/1KG4 by Texas Instruments, a high-quality Digital-to-Analog Converter that offers precision and reliability. With Texas Instruments' renowned reputation for excellence, this converter provides exceptional performance in a wide range of applications. Experience the value of fast settling times, low linearity error, and excellent temperature tolerance. Elevate your projects with the DAC7731EC/1KG4 and unlock new possibilities in your designs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

The high maximum analog output voltage allows for a wide range of signal outputs, making this DAC suitable for various applications.

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures the package can withstand normal wear and tear, increasing the longevity of the product.

Surface Mount: YES

Being surface mount compatible makes installation and circuit board design easier, streamlining the manufacturing process.

No. of Functions: 1

The single function design simplifies operation and reduces complexity, making it easier to integrate into existing systems.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy integration into circuit designs.

No. of Bits: 16

With 16 bits, this DAC offers high resolution and accuracy in converting digital signals to analog, ensuring precise output.

Maximum Settling Time: 5 us

The fast settling time minimizes distortion and ensures rapid response to input changes, ideal for time-sensitive applications.

Maximum Linearity Error (EL): 0.0046%

The low linearity error results in accurate and faithful reproduction of input signals, maintaining signal integrity.

Power Supplies (V): 5,+-15

The wide range of power supply voltages allows for flexibility in system integration, accommodating different power sources.

No. of Terminals: 24

The ample number of terminals provides multiple connection points, enabling easy interfacing with external components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The compact small outline package with shrink pitch saves space on the circuit board, ideal for compact designs.

Nominal Settling Time (tstl): 3 us

The quick nominal settling time ensures rapid response and accuracy in signal conversion, suitable for real-time applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DAC can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, enhancing product versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in board layout and connection options, allowing for convenient integration into different setups.

Maximum Seated Height: 2 mm

The low maximum seated height minimizes space requirements, making this DAC suitable for slim and compact designs.

Width: 5.3 mm

The narrow width allows for efficient space utilization on the circuit board, suitable for designs with tight constraints.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and assembly, contributing to product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the reflow soldering process without damage, ensuring proper assembly.

Minimum Analog Output Voltage: -10 V

The minimum analog output voltage allows for bi-polar signal output, expanding the range of applications this DAC can be used for.

Length: 8.2 mm

The compact length of the package ensures space-efficient placement on the circuit board, suitable for designs with space constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding industrial environments, making this DAC a robust choice for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable electrical connections.

Input Format: SERIAL

Serial input format allows for simplified data transfer and communication, making this DAC ideal for applications requiring serial data transmission.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product is essential for converting digital signals to analog for various industrial and consumer applications.

Nominal Supply Voltage: 15 V

The high nominal supply voltage ensures compatibility with various power sources, offering flexibility in system integration.

Nominal Negative Supply Voltage: -15 V

The negative supply voltage capability enables bi-polar operation and versatile signal output, making this DAC suitable for a wide range of applications.

Terminal Pitch: 0.65 mm

The small terminal pitch facilitates dense component placement on the circuit board, ideal for designs with high component density.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the level of protection against moisture damage during storage and handling, ensuring product reliability.

Input Bit Code: BINARY, OFFSET BINARY

With support for binary and offset binary input bit codes, this DAC offers versatility in handling different input data formats, ensuring compatibility with various systems.

Technical Specifications

Digital-to-Analog Converters DAC7731EC/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0046 %

Nominal Settling Time (tstl):

3 µs

Maximum Settling Time:

5 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.323 in (8.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP24,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Trade Compliance

DAC7731EC/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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