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OPA3692IDBQRG4

Texas Instruments

OPA3692IDBQRG4 by Texas Instruments

Texas Instruments OPA3692IDBQRG4 is a 16-terminal video amplifier with 3 functions. Operating b/w -40 to 85°C, it has a supply voltage range of 2.5V to 6V. Ideal for audio and video applications, this IC is surface mountable and features a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,793 parts In-Stock

1+ parts

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8,793

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Digiode

USA . 4,729 parts In-Stock

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4,729

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$1.274

100+ parts

-

1k+ parts

$2.036

10k+ parts

-

1,974

$1.274

-

$2.036

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ChromeModa Solutions

Germany . 5,004 parts In-Stock

1+ parts

$1.431

100+ parts

$1.173

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-

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5,004

$1.431

$1.173

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IDEA Electronic Components Group

UK . 55 parts In-Stock

1+ parts

$1.431

100+ parts

-

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$1.288

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55

$1.431

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$1.288

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One Stop Electronics

USA . 317 parts In-Stock

1+ parts

$3.800

100+ parts

-

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317

$3.800

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AZTECH Wire

Italy . 742 parts In-Stock

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$17.421

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742

$17.421

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A-Z Elektronik GmbH

Germany . 7,229 parts In-Stock

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7,229

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Kepictronics

USA . 5,120 parts In-Stock

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5,120

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Corphita

USA . 3,440 parts In-Stock

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3,440

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DigiPath Technology Company

USA . 1,773 parts In-Stock

1+ parts

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100+ parts

$1.290

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1,773

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$1.290

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Perfect Parts

USA . 633 parts In-Stock

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633

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Microchip USA

USA . 276 parts In-Stock

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276

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Overview

Experience superior audio and video amplification with the OPA3692IDBQRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for various applications in the audio and video amplifier category. With its advanced technology and industrial-grade design, this product offers customers unmatched value and performance. Enhance your audio and video systems with the OPA3692IDBQRG4 and enjoy crystal-clear sound and sharp visuals like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it easier to handle and less susceptible to damage during handling and transportation.

Surface Mount: YES

Being surface mountable allows for easy and compact installation, making the product suitable for space-constrained applications.

No. of Functions: 3

Having three functions in one device increases the versatility and functionality of the product, allowing for more capabilities in a single package.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to mount and integrate the amplifier into existing systems, providing a more convenient and space-efficient solution.

General IC Type: VIDEO AMPLIFIER

Being a video amplifier specifically designed for enhancing video signals, this product ensures high-quality video output for improved viewing experience.

No. of Terminals: 16

Having 16 terminals provides multiple connection points for input and output signals, enabling more versatile connectivity options for different audio and video devices.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a compact design, making it suitable for applications where space is limited without compromising on performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this amplifier can withstand extended use under varying environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and connection options, catering to different mounting configurations and requirements.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm enables a slim and compact design, ideal for space-constrained applications where height clearance is limited.

Width: 3.9 mm

The narrow width of 3.9 mm allows for a compact footprint, making the product suitable for tight spaces and ensuring easy integration into various systems.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement of 2.5 V ensures energy-efficient operation and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product is easy to solder and assemble, facilitating quick and efficient manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable and durable soldering, ensuring long-term performance and stability in various operating conditions.

Length: 4.9 mm

The compact length of 4.9 mm contributes to the overall space-saving design of the amplifier, making it suitable for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this amplifier is built to withstand harsh environments and rigorous conditions, ensuring reliable performance in demanding settings.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-performance audio and video amplification, delivering clear and crisp signals for an enhanced listening and viewing experience.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, minimizing the risk of signal loss or interference, and ensuring consistent performance.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for precise and compact soldering, ensuring a secure connection and optimal signal transmission in a space-efficient manner.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this product has moderate moisture sensitivity, making it suitable for a wide range of environments and ensuring long-term durability under varying conditions.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6 V allows for compatibility with a wide range of power sources, providing flexibility in connectivity options and ensuring versatile application capabilities.

Technical Specifications

Audio & Video Amplifiers OPA3692IDBQRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 5V TO 12 V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

OPA3692IDBQRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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