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LX4F232H5QDFIGA3

Texas Instruments

LX4F232H5QDFIGA3 by Texas Instruments

The Texas Instruments LX4F232H5QDFIGA3 microcontroller features 32-bit architecture, 144 terminals, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring CAN, I2C, SPI connectivity with 24 ADC channels and 12-bit resolution. Operating temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,687 parts In-Stock

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5,687

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Digiode

USA . 1,416 parts In-Stock

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1,416

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ComSIT Distribution GmbH

Germany . 558 parts In-Stock

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558

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Distributors (Availability)

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AZTECH Wire

Italy . 503 parts In-Stock

1+ parts

$8.049

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503

$8.049

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Microchip USA

USA . 362 parts In-Stock

1+ parts

$28.660

100+ parts

$28.250

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$28.040

10k+ parts

$27.840

362

$28.660

$28.250

$28.040

$27.840

One Stop Electronics

USA . 880 parts In-Stock

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$30.000

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880

$30.000

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Parana Technologies

USA . 206 parts In-Stock

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$55.848

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206

$55.848

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ChromeModa Solutions

Germany . 3,661 parts In-Stock

1+ parts

$62.750

100+ parts

$51.455

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3,661

$62.750

$51.455

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

1+ parts

$62.750

100+ parts

$59.612

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$56.475

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2,017

$62.750

$59.612

$56.475

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Corphita

USA . 2,405 parts In-Stock

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2,405

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DigiPath Technology Company

USA . 781 parts In-Stock

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$56.575

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781

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$56.575

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Overview

Discover the ultimate solution for your microcontroller needs with the LX4F232H5QDFIGA3 by Texas Instruments. This top-of-the-line product offers unmatched quality and reliability, thanks to its trusted manufacturer. Perfect for a wide range of applications, this microcontroller provides exceptional value, benefits, and advantages to customers looking for cutting-edge technology. Upgrade your projects with the LX4F232H5QDFIGA3 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, suitable for various applications.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows for fast processing speed and performance, making it suitable for applications that require quick data processing.

RAM Bytes: 32768

With a large RAM capacity of 32768 bytes, this microcontroller can handle complex calculations and data storage efficiently.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

Connectivity: CAN(2), I2C(6), IRDA, QEI(2), MICROWIRE, SPI, SSI(4), UART(8), USB

The wide range of connectivity options makes this microcontroller versatile and compatible with various communication protocols, expanding its application possibilities.

Technical Specifications

Microcontrollers LX4F232H5QDFIGA3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

105

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, QEI(2), MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(16), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

LX4F232H5QDFIGA3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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