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LX4F230H5QRFIGA1

Texas Instruments

LX4F230H5QRFIGA1 by Texas Instruments

The Texas Instruments LX4F230H5QRFIGA1 is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at speeds up to 80 rpm, it is ideal for industrial applications requiring a temperature range of -40 to 85°C. This surface-mount device features a quad-terminal position in a square-shaped flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,289 parts In-Stock

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5,289

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Digiode

USA . 4,963 parts In-Stock

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4,963

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Distributors (Availability)

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One Stop Electronics

USA . 1,573 parts In-Stock

1+ parts

$7.000

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1,573

$7.000

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AZTECH Wire

Italy . 493 parts In-Stock

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$8.172

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493

$8.172

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Parana Technologies

USA . 636 parts In-Stock

1+ parts

$75.957

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636

$75.957

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ChromeModa Solutions

Germany . 4,347 parts In-Stock

1+ parts

$85.345

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$69.983

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4,347

$85.345

$69.983

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IDEA Electronic Components Group

UK . 515 parts In-Stock

1+ parts

$85.345

100+ parts

$81.078

1k+ parts

$76.810

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515

$85.345

$81.078

$76.810

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Corphita

USA . 1,081 parts In-Stock

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1,081

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DigiPath Technology Company

USA . 144 parts In-Stock

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$76.947

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144

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$76.947

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Overview

Unleash the power of innovation with the LX4F230H5QRFIGA1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers quality microcontrollers that set new standards for performance and reliability. The LX4F230H5QRFIGA1 is designed to excel in a wide range of applications, offering customers unmatched value and benefits. Whether you're developing IoT devices, consumer electronics, or industrial automation systems, this microcontroller provides the speed, efficiency, and versatility you need to bring your ideas to life. Choose Texas Instruments for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Enables easy installation and integration on PCBs.

Package Shape: SQUARE

Facilitates efficient use of space on the PCB.

Bit Size: 32

Offers a good balance between processing power and efficiency for many applications.

Power Supplies (V): 1.2,3.3

Allows flexibility in power options to meet different system requirements.

No. of Terminals: 64

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): FLATPACK

Provides a low profile and compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher temperature requirements.

CPU Family: CORTEX-M4

Offers a high-performance ARM Cortex-M4 processor for efficient processing capability.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, ideal for use in harsh environments.

Terminal Position: QUAD

Quad terminal position enables stable and secure connection on the PCB.

ROM Words: 262144

Large ROM size for storing program instructions and data.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

RAM Bytes: 32768

Adequate RAM for temporary data storage during operation.

Terminal Form: GULL WING

Gull wing terminals offer robust mechanical connection and easy soldering.

ROM Programmability: FLASH

Flash ROM type allows for reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB.

Speed: 80 rpm

Operates at a speed of 80 rotations per minute, suitable for various real-time applications.

Technical Specifications

Microcontrollers LX4F230H5QRFIGA1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-M4

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LX4F230H5QRFIGA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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