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LX4F231H5QRFIGB0

Texas Instruments

LX4F231H5QRFIGB0 by Texas Instruments

The Texas Instruments LX4F231H5QRFIGB0 is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Featuring a Cortex-M4F CPU, it operates b/w -40 to 85°C, ideal for industrial applications. With a peak reflow temperature of 260°C and low supply current of 4.5 mA, this MCU in a square package is suitable for high-speed processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,944 parts In-Stock

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Digiode

USA . 2,016 parts In-Stock

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2,016

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Distributors (Availability)

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One Stop Electronics

USA . 1,502 parts In-Stock

1+ parts

$3.000

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1,502

$3.000

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AZTECH Wire

Italy . 291 parts In-Stock

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$11.118

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291

$11.118

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Microchip USA

USA . 309 parts In-Stock

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$26.200

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$25.830

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$25.640

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$25.460

309

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$25.640

$25.460

Parana Technologies

USA . 1,433 parts In-Stock

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$50.651

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1,433

$50.651

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ChromeModa Solutions

Germany . 4,925 parts In-Stock

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$56.911

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$46.667

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4,925

$56.911

$46.667

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IDEA Electronic Components Group

UK . 892 parts In-Stock

1+ parts

$56.911

100+ parts

$54.065

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$51.220

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892

$56.911

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$51.220

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Corphita

USA . 4,724 parts In-Stock

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DigiPath Technology Company

USA . 622 parts In-Stock

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$51.311

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Overview

Experience the power of innovation with the Texas Instruments LX4F231H5QRFIGB0 microcontroller. Crafted with precision and expertise, this device is designed to deliver unmatched performance in a variety of applications. From industrial automation to consumer electronics, the possibilities are endless. With cutting-edge technology and reliable quality, Texas Instruments exceeds expectations every time. Embrace the future of microcontrollers and unlock a world of possibilities with the LX4F231H5QRFIGB0. Elevate your projects with unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto PCBs.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB.

Bit Size: 32

32-bit architecture ensures high performance and processing capabilities for the microcontroller.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages allows for flexibility in different application scenarios.

No. of Terminals: 64

64 terminals provide sufficient connectivity options for connecting external components.

Package Style (Meter): FLATPACK

Flatpack package style allows for compact design and easy assembly onto the PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high temperature environments.

CPU Family: CORTEX-M4F

Utilizing the Cortex-M4F CPU family ensures high processing power and efficiency.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can withstand cold temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides good conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and soldering.

ROM Words: 262144

With 262,144 ROM words, the microcontroller can store a large amount of program data.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and component bonding.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

RAM Bytes: 32768

32,768 RAM bytes allow for efficient data storage and processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Maximum Supply Current: 4.5 mA

Maximum supply current of 4.5 mA ensures efficient power usage by the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of the microcontroller firmware.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5 mm provides fine spacing for compact PCB design and layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand mild moisture exposure during handling and assembly.

Speed: 80 rpm

Operating speed of 80 rpm provides fast response and processing capabilities for the microcontroller.

Technical Specifications

Microcontrollers LX4F231H5QRFIGB0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LX4F231H5QRFIGB0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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