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LX4F232H5QDFIGB0

Texas Instruments

LX4F232H5QDFIGB0 by Texas Instruments

The Texas Instruments LX4F232H5QDFIGB0 microcontroller features 32-bit architecture, 144 terminals, and a max clock frequency of 25 MHz. With ADC and DMA channels, it is ideal for industrial applications requiring high-speed data processing and connectivity via CAN, I2C, SPI, UART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,785 parts In-Stock

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6,785

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Digiode

USA . 4,252 parts In-Stock

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4,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$12.556

100+ parts

-

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209

$12.556

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One Stop Electronics

USA . 1,180 parts In-Stock

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$32.000

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-

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1,180

$32.000

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Parana Technologies

USA . 981 parts In-Stock

1+ parts

$60.756

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981

$60.756

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DigiPath Technology Company

USA . 142 parts In-Stock

1+ parts

$66.900

100+ parts

$61.548

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142

$66.900

$61.548

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ChromeModa Solutions

Germany . 2,565 parts In-Stock

1+ parts

$68.265

100+ parts

$55.977

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2,565

$68.265

$55.977

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IDEA Electronic Components Group

UK . 2,091 parts In-Stock

1+ parts

$68.265

100+ parts

$64.852

1k+ parts

$61.438

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2,091

$68.265

$64.852

$61.438

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Corphita

USA . 2,174 parts In-Stock

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2,174

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Overview

Experience the cutting-edge technology of the LX4F232H5QDFIGB0 microcontroller by Texas Instruments. With high-quality manufacturing and a wide range of applications, this product offers unmatched value and benefits to customers. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and reliability. Trust Texas Instruments for premium quality and innovation in microcontroller technology. Choose the LX4F232H5QDFIGB0 for your next project and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 1.32 V

Allows for a wide range of input voltage, providing flexibility in power supply options.

Bit Size: 32

Higher bit size allows for more complex operations and calculations to be performed by the microcontroller.

ROM Words: 262144

Large ROM size provides ample memory for storing programs and data, allowing for versatile usage.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, enhancing overall performance.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast operation and response time, suitable for applications requiring real-time processing.

RAM Bytes: 32768

Generous RAM size allows for multiple tasks to be handled simultaneously without compromising performance.

Connectivity: CAN(2), I2C(6), IRDA, QEI(2), MICROWIRE, SPI, SSI(4), UART(8), USB

Multiple connectivity options ensure compatibility with various external devices and communication protocols, expanding the product's usability.

Technical Specifications

Microcontrollers LX4F232H5QDFIGB0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

105

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, QEI(2), MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(16), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

LX4F232H5QDFIGB0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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