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LX4F232H5QDFIGA1

Texas Instruments

LX4F232H5QDFIGA1 by Texas Instruments

The Texas Instruments LX4F232H5QDFIGA1 microcontroller features 32-bit size, 25 MHz clock frequency, and 105 I/O lines. Ideal for industrial applications with ADC and DMA channels, it operates b/w -40 to 85 °C temperature range. With a low profile flatpack package style, it is suitable for various embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,277 parts In-Stock

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3,277

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Digiode

USA . 1,145 parts In-Stock

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1,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$15.795

100+ parts

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342

$15.795

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One Stop Electronics

USA . 530 parts In-Stock

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$17.000

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530

$17.000

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Parana Technologies

USA . 637 parts In-Stock

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$45.206

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637

$45.206

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DigiPath Technology Company

USA . 746 parts In-Stock

1+ parts

$49.777

100+ parts

$45.795

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746

$49.777

$45.795

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ChromeModa Solutions

Germany . 4,096 parts In-Stock

1+ parts

$50.793

100+ parts

$41.650

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4,096

$50.793

$41.650

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$50.793

100+ parts

$48.253

1k+ parts

$45.714

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1,963

$50.793

$48.253

$45.714

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Corphita

USA . 4,136 parts In-Stock

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Overview

Experience the power and precision of the LX4F232H5QDFIGA1 by Texas Instruments, a top-tier microcontroller that sets the standard for quality and performance. With advanced technology and superior manufacturing from Texas Instruments, this microcontroller offers unparalleled reliability and efficiency in a wide range of applications. From industrial automation to consumer electronics, the LX4F232H5QDFIGA1 delivers exceptional value, benefits, and advantages to customers seeking cutting-edge solutions for their projects. Upgrade your designs with the LX4F232H5QDFIGA1 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the microcontroller, making it resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures stable and reliable operation of the microcontroller under various conditions.

Package Shape: SQUARE

The square package shape facilitates uniformity in design layout and makes it easier to place on the PCB.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, enabling the microcontroller to handle complex tasks smoothly.

No. of Terminals: 144

Having a high number of terminals allows for multiple connections and interfaces, offering flexibility in system design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with low profile and fine pitch, ideal for applications where space is limited.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage provides energy efficiency and extends the battery life of devices powered by the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand heat and operate reliably in industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to function in extreme cold conditions, making it suitable for various applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Having DMA channels improves data transfer efficiency and offloads the CPU, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB routing and soldering, making it convenient for assembly and maintenance.

Maximum Seated Height: 1.6 mm

The low seated height allows for slim and compact device designs, especially important in space-constrained applications.

Width: 20 mm

A moderate width of 20 mm ensures compatibility with standard PCB sizes and facilitates easy integration into existing designs.

Maximum Clock Frequency: 25 MHz

The high clock frequency of 25 MHz enables fast processing speeds and responsive performance in real-time applications.

Length: 20 mm

A length of 20 mm offers a balanced form factor, suitable for a wide range of applications without compromising on performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures robustness and reliability, making it suitable for harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances processing efficiency and speed, optimizing performance for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and allows for efficient heat dissipation, ensuring stable connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V strikes a balance between power efficiency and performance, catering to a wide range of applications.

PWM Channels: YES

The availability of PWM channels enables precise control of outputs such as motor speed or LED brightness, adding versatility to the microcontroller.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for quick and easy firmware updates, improving flexibility and scalability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enhances connectivity and signal integrity, essential for high-speed data transmission.

Speed: 80 rpm

With a speed rating of 80 rpm, the microcontroller can efficiently process instructions and data, meeting the performance demands of diverse applications.

No. of I/O Lines: 105

Having a high number of I/O lines provides ample interfacing opportunities, allowing for versatile connectivity and control capabilities.

Technical Specifications

Microcontrollers LX4F232H5QDFIGA1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

105

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LX4F232H5QDFIGA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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