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LX4F232H5QCFIGA1

Texas Instruments

LX4F232H5QCFIGA1 by Texas Instruments

The Texas Instruments LX4F232H5QCFIGA1 microcontroller features 32-bit size, 25 MHz clock frequency, and 69 I/O lines. Ideal for industrial applications, it offers ADC and DMA channels with ROM programmability. With a low profile package style and quad terminal position, it operates b/w -40 to 85 °C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,391 parts In-Stock

1+ parts

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8,391

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Digiode

USA . 3,106 parts In-Stock

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3,106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$10.264

100+ parts

-

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763

$10.264

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One Stop Electronics

USA . 700 parts In-Stock

1+ parts

$16.000

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-

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700

$16.000

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Parana Technologies

USA . 188 parts In-Stock

1+ parts

$24.601

100+ parts

-

1k+ parts

$25.267

10k+ parts

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188

$24.601

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$25.267

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DigiPath Technology Company

USA . 1,693 parts In-Stock

1+ parts

$27.089

100+ parts

$24.922

1k+ parts

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1,693

$27.089

$24.922

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ChromeModa Solutions

Germany . 4,092 parts In-Stock

1+ parts

$27.642

100+ parts

$22.666

1k+ parts

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4,092

$27.642

$22.666

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

1+ parts

$27.642

100+ parts

$26.260

1k+ parts

$24.878

10k+ parts

-

1,158

$27.642

$26.260

$24.878

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Corphita

USA . 359 parts In-Stock

1+ parts

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359

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Kepictronics

USA . 61 parts In-Stock

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61

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ChipstoGo Electronic ltd

UK . 30 parts In-Stock

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30

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Overview

Discover the exceptional LX4F232H5QCFIGA1 microcontroller by Texas Instruments, a leading manufacturer known for superior quality and reliability. Ideal for a wide range of applications, this advanced microcontroller offers unmatched value and benefits to customers. With its cutting-edge technology and innovative features, this product ensures optimal performance and efficiency. Experience seamless operation and enhanced functionality with the LX4F232H5QCFIGA1 microcontroller, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable, lightweight, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply design and operation.

Package Shape: SQUARE

The square shape of the package provides efficient use of PCB real estate and allows for easier routing of traces.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance, making the product suitable for complex applications.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and interface capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact size, low profile, and fine pitch, making it ideal for space-constrained applications and high-density PCB designs.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature extremes, suitable for industrial applications.

ADC Channels: YES

Built-in analog-to-digital converter (ADC) channels provide the ability to interface with analog sensors and signals, expanding the product's application range.

DMA Channels: YES

Direct memory access (DMA) channels improve data transfer efficiency and offload the main CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy PCB mounting and secure soldering connections.

Maximum Seated Height: 1.6 mm

The low maximum seated height saves vertical space on the PCB and enables compact device designs.

Width: 14 mm

The compact width allows for efficient PCB layout and integration into small form factor devices.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast data processing and real-time operations, suitable for demanding applications.

Length: 14 mm

Compact length design provides flexibility in placement on the PCB and supports miniaturized product designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in rugged industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with reduced instruction set computing (RISC) architecture offers efficient data processing and low power consumption.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology provides low power consumption, high noise immunity, and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and reliable solder connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for the microcontroller, ensuring consistent performance.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of analog outputs, ideal for motor control and dimming applications.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and field programmability, enhancing flexibility and future-proofing the product.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density PCB designs and supports miniaturization of the overall product.

Speed: 80 rpm

The high speed capability allows for fast data processing and real-time control in dynamic applications.

No. of I/O Lines: 69

Having a high number of input/output (I/O) lines provides versatile connectivity options and interface capabilities.

Technical Specifications

Microcontrollers LX4F232H5QCFIGA1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

69

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LX4F232H5QCFIGA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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