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LX4F231H5QRFIGA1

Texas Instruments

LX4F231H5QRFIGA1 by Texas Instruments

The Texas Instruments LX4F231H5QRFIGA1 microcontroller features 32-bit architecture, 262144 ROM words, and 32768 RAM bytes. With a max clock frequency of 25 MHz, it is ideal for industrial applications requiring CAN, I2C, SPI connectivity and 12-Ch 12-Bit ADC channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,928 parts In-Stock

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1,928

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Digiode

USA . 1,843 parts In-Stock

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1,843

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Distributors (Availability)

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AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$6.521

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742

$6.521

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One Stop Electronics

USA . 1,495 parts In-Stock

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$29.000

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1,495

$29.000

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Parana Technologies

USA . 455 parts In-Stock

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$45.642

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455

$45.642

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DigiPath Technology Company

USA . 954 parts In-Stock

1+ parts

$50.257

100+ parts

$46.237

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954

$50.257

$46.237

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ChromeModa Solutions

Germany . 1,902 parts In-Stock

1+ parts

$51.283

100+ parts

$42.052

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1,902

$51.283

$42.052

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IDEA Electronic Components Group

UK . 1,287 parts In-Stock

1+ parts

$51.283

100+ parts

$48.719

1k+ parts

$46.155

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1,287

$51.283

$48.719

$46.155

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Corphita

USA . 4,670 parts In-Stock

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4,670

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Overview

Experience the power of innovation with the LX4F231H5QRFIGA1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers advanced features such as ADC channels, DMA channels, and PWM channels. With its compact design and high-performance capabilities, the LX4F231H5QRFIGA1 provides exceptional value to customers looking for cutting-edge technology. Trust Texas Instruments to elevate your projects to the next level with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in power supply options.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and power consumption.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing speeds.

ADC Channels: YES

Built-in analog to digital converters enhance the microcontroller's capability to interface with analog sensors or devices.

DMA Channels: YES

Direct Memory Access channels help offload data transfer tasks from the CPU, improving overall system efficiency.

Connectivity: CAN(2), I2C(6), IRDA, LIN, MICROWIRE, SPI, SSI(4), UART(8), USB

Multiple connectivity options provide versatile communication interfaces for various applications.

Technical Specifications

Microcontrollers LX4F231H5QRFIGA1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, LIN, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(2), DMA(32), QEI(2), POR, PWM(16), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LX4F231H5QRFIGA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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