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LMX5452SMX/NOPB

Texas Instruments

LMX5452SMX/NOPB by Texas Instruments

LMX5452SMX/NOPB by Texas Instruments is a telecom interface IC with 60 terminals in a low profile grid array package. It operates at temperatures from -40 to 85°C, suitable for industrial use. With CMOS technology and 0.8mm terminal pitch, it is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,643 parts In-Stock

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Digiode

USA . 772 parts In-Stock

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Anansix

USA . 248 parts In-Stock

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248

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Bristol Electronics

USA . 64 parts In-Stock

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64

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Parana Technologies

USA . 436 parts In-Stock

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$9.373

100+ parts

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$9.994

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436

$9.373

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$9.994

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AZTECH Wire

Italy . 591 parts In-Stock

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$10.243

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591

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DigiPath Technology Company

USA . 523 parts In-Stock

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$10.320

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$9.495

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523

$10.320

$9.495

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ChromeModa Solutions

Germany . 5,652 parts In-Stock

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$10.531

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$8.635

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$10.531

$8.635

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IDEA Electronic Components Group

UK . 1,492 parts In-Stock

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$10.531

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$10.004

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$9.478

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$10.531

$10.004

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$15.709

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$14.295

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$12.881

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550

$15.709

$14.295

$12.881

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One Stop Electronics

USA . 1,271 parts In-Stock

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$55.000

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Component Stockers USA

USA . 610 parts In-Stock

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$99.990

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Alle Elektronik GmbH

Germany . 4,178 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,164 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,322 parts In-Stock

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Overview

Enhance your telecom equipment with the LMX5452SMX/NOPB by Texas Instruments. Crafted with precision and reliability, this Telecom Interface IC offers unparalleled performance and functionality. Ideal for a wide range of applications in the telecommunications industry, this product guarantees seamless connectivity and efficient operation. Trust in Texas Instruments' reputation for excellence and innovation to deliver top-quality solutions for your technology needs. Upgrade your systems today with the LMX5452SMX/NOPB and experience the superior value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and labor costs during assembly.

Power Supplies (V): 3/3.3

Operates efficiently with common voltage standards, ensuring compatibility with existing systems.

No. of Terminals: 60

Provides a high level of connectivity options for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and space-saving design layouts, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for use in industrial settings where heat may be a concern.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extremely cold environments, providing reliable performance in a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and ensures good electrical conductivity for reliable signal transmission.

Terminal Position: BOTTOM

Facilitates easy mounting on PCBs and simplifies the connection process with other circuit components.

Maximum Seated Height: 1.3 mm

Low profile design allows for compact device packaging, making it suitable for applications with limited space.

Width: 6 mm

Slim form factor enables integration into small devices and PCB layouts, optimizing space usage.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the IC can withstand the reflow soldering process without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

Withstands high temperature soldering processes, ensuring secure and robust connections during assembly.

Length: 9 mm

Compact size allows for flexible placement in various device designs, accommodating different layout requirements.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, providing long-term durability and performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, ideal for telecom applications requiring efficiency.

Terminal Form: BALL

Ball terminals provide reliable connections and easy mounting on PCBs, enhancing overall system reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Terminal Pitch: 0.8 mm

Fine pitch terminals enable high-density interconnections, ideal for space-constrained designs requiring multiple connections.

Moisture Sensitivity Level (MSL): 4

With MSL 4 rating, the IC can withstand multiple reflow cycles without risking moisture damage, ensuring long-term reliability.

Technical Specifications

Other Function Telecom Interface ICs LMX5452SMX/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B60

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA60,6X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

LMX5452SMX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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