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LMX5453SM/NOPB

Texas Instruments

LMX5453SM/NOPB by Texas Instruments

LMX5453SM/NOPB by Texas Instruments is a telecom IC with 60 terminals in a grid array package. It operates b/w -40 to 85°C, with a data rate of 12 Mbps and nominal voltage of 2.75V. Ideal for telecom circuits, this CMOS technology IC is surface mountable and has low profile design for industrial applications.

Median Price

$11.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 273 parts In-Stock

1+ parts

$5.283

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273

$5.283

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Chip1Stop

Japan . 290 parts In-Stock

1+ parts

$11.900

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290

$11.900

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Verical

USA . 273 parts In-Stock

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$12.621

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273

$12.621

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Distributors (In-Stock)

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Digiode

USA . 2,083 parts In-Stock

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$8.042

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2,083

$8.042

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Vyrian

USA . 7,335 parts In-Stock

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7,335

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Anansix

USA . 1,733 parts In-Stock

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1,733

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Distributors (Availability)

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Corphita

USA . 4,211 parts In-Stock

1+ parts

$7.618

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4,211

$7.618

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Parana Technologies

USA . 913 parts In-Stock

1+ parts

$8.469

100+ parts

$786.497

1k+ parts

$7.622

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-

913

$8.469

$786.497

$7.622

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DigiPath Technology Company

USA . 43 parts In-Stock

1+ parts

$9.326

100+ parts

$8.580

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43

$9.326

$8.580

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ChromeModa Solutions

Germany . 3,344 parts In-Stock

1+ parts

$9.516

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$7.803

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3,344

$9.516

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

1+ parts

$9.516

100+ parts

$9.040

1k+ parts

$8.564

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2,316

$9.516

$9.040

$8.564

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Perfect Parts

USA . 748 parts In-Stock

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748

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Overview

Experience flawless communication with the LMX5453SM/NOPB from Texas Instruments. Crafted with precision and quality, this telecom interface IC offers unparalleled performance in a compact package. Whether you're looking to enhance your telecommunications systems or improve connectivity in your devices, this product is the perfect solution. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the LMX5453SM/NOPB and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material is lightweight and durable, making the product suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

No. of Terminals: 60

Having a high number of terminals allows for multiple connections and functions to be supported, increasing the product's versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Nominal Supply Voltage: 2.75 V

Having a low nominal supply voltage can help reduce power consumption and heat dissipation, leading to energy efficiency.

Technical Specifications

Other Function Telecom Interface ICs LMX5453SM/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

12 Mbps

JESD-30 Code:

R-PBGA-B60

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

LMX5453SM/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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