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LMX5001VBC

Texas Instruments

LMX5001VBC by Texas Instruments

LMX5001VBC by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage, suitable for telecom circuits. It features a flatpack, thin profile package style and operates b/w 0-70°C. This surface-mount IC has a terminal pitch of 0.5mm and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,729 parts In-Stock

1+ parts

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5,729

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

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4,000

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Digiode

USA . 2,168 parts In-Stock

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2,168

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Anansix

USA . 349 parts In-Stock

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349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,217 parts In-Stock

1+ parts

$8.646

100+ parts

-

1k+ parts

$9.317

10k+ parts

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2,217

$8.646

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$9.317

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DigiPath Technology Company

USA . 557 parts In-Stock

1+ parts

$9.521

100+ parts

$8.759

1k+ parts

-

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557

$9.521

$8.759

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ChromeModa Solutions

Germany . 5,384 parts In-Stock

1+ parts

$9.715

100+ parts

$7.966

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5,384

$9.715

$7.966

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IDEA Electronic Components Group

UK . 946 parts In-Stock

1+ parts

$9.715

100+ parts

$9.229

1k+ parts

$8.744

10k+ parts

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946

$9.715

$9.229

$8.744

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AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$13.343

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802

$13.343

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One Stop Electronics

USA . 489 parts In-Stock

1+ parts

$115.000

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489

$115.000

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Corphita

USA . 577 parts In-Stock

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577

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Overview

Experience seamless communication with the LMX5001VBC by Texas Instruments, a cutting-edge solution in telecom interface ICs. Crafted with precision and expertise, this product guarantees top-notch quality and reliability. Whether you're looking to enhance your telecommunications system or streamline your network infrastructure, the LMX5001VBC is designed to exceed your expectations. Unlock a world of possibilities with this versatile product that offers unmatched value, benefits, and advantages to customers seeking superior performance. Elevate your communication experience with Texas Instruments LMX5001VBC - innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures long-term reliability of the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in assembly.

Power Supplies (V): 3.3

Operates on a common voltage supply, making it compatible with standard power sources.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for various operating environments.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for a secure connection.

Width: 7 mm

Compact size allows for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Suitable for commercial applications that do not require extreme temperature ranges.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, compatible with many electronic systems.

Technical Specifications

Other Function Telecom Interface ICs LMX5001VBC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMX5001VBC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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