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LMX5252LQ/NOPB

Texas Instruments

LMX5252LQ/NOPB by Texas Instruments

LMX5252LQ/NOPB by Texas Instruments is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 2.75V and consumes 0.055mA max current. This CMOS technology chip carrier is suitable for telecom circuit applications due to its compact square shape and low power consumption.

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

$4.380

1k+ parts

$3.920

10k+ parts

$3.690

1,492

-

$4.380

$3.920

$3.690

DigiKey

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

$5.050

1k+ parts

-

10k+ parts

-

1,492

-

$5.050

-

-

Verical

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

$5.475

1k+ parts

$4.900

10k+ parts

$4.612

1,492

-

$5.475

$4.900

$4.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 491 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$4.617

-

-

-

Vyrian

USA . 1,080 parts In-Stock

1+ parts

$4.860

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

$4.860

-

-

-

DigiKey Marketplace

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,492

-

-

-

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A&K Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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-

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Bristol Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,543 parts In-Stock

1+ parts

$4.374

100+ parts

-

1k+ parts

-

10k+ parts

-

4,543

$4.374

-

-

-

Ampacity Inc.

Singapore . 1,394 parts In-Stock

1+ parts

$8.990

100+ parts

-

1k+ parts

-

10k+ parts

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1,394

$8.990

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-

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Parana Technologies

USA . 1,231 parts In-Stock

1+ parts

$10.142

100+ parts

-

1k+ parts

$10.683

10k+ parts

-

1,231

$10.142

-

$10.683

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ChromeModa Solutions

Germany . 4,460 parts In-Stock

1+ parts

$11.396

100+ parts

$9.345

1k+ parts

-

10k+ parts

-

4,460

$11.396

$9.345

-

-

IDEA Electronic Components Group

UK . 579 parts In-Stock

1+ parts

$11.396

100+ parts

$10.826

1k+ parts

$10.256

10k+ parts

-

579

$11.396

$10.826

$10.256

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$17.451

100+ parts

$15.880

1k+ parts

$14.310

10k+ parts

-

600

$17.451

$15.880

$14.310

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DigiPath Technology Company

USA . 1,411 parts In-Stock

1+ parts

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100+ parts

$10.275

1k+ parts

-

10k+ parts

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1,411

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$10.275

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-

Overview

Experience seamless communication with the LMX5252LQ/NOPB by Texas Instruments, a top-quality telecom interface IC that is sure to exceed your expectations. Manufactured by industry leader Texas Instruments, this product offers unparalleled reliability and performance. Ideal for a wide range of applications in the telecommunications industry, this chip carrier with a very thin profile delivers exceptional value, benefits, and advantages to customers. Trust in Texas Instruments to provide cutting-edge technology that will elevate your communications experience.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in the manufacturing process.

Package Shape: SQUARE

Square packages are more space-efficient and offer better thermal performance compared to other shapes.

Power Supplies (V): 2.75

Optimal voltage for the operation of the telecom interface IC, ensuring reliable performance.

No. of Terminals: 36

Sufficient number of terminals for connecting various components and peripherals, offering flexibility in design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and thin profile package enhances thermal management and reduces space requirements in the design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the telecom interface IC energy-efficient and reliable.

Nominal Supply Voltage: 2.75 V

Optimal supply voltage ensures consistent and stable operation of the telecom interface IC.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the telecom interface IC has a moderate sensitivity to moisture, making it suitable for industrial applications with controlled environments.

Technical Specifications

Other Function Telecom Interface ICs LMX5252LQ/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.75

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.055 mA

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

LMX5252LQ/NOPB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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