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LMX5452SMX

Texas Instruments

LMX5452SMX by Texas Instruments

LMX5452SMX by Texas Instruments is a CMOS telecom IC with 60 terminals in a grid array package. Operating at -40 to 85°C, it has a peak reflow temp of 235°C and is suitable for industrial applications requiring a power supply of 3/3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,703 parts In-Stock

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Anansix

USA . 1,650 parts In-Stock

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Digiode

USA . 978 parts In-Stock

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978

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Distributors (Availability)

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Parana Technologies

USA . 2,122 parts In-Stock

1+ parts

$9.119

100+ parts

$846.832

1k+ parts

$8.207

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2,122

$9.119

$846.832

$8.207

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DigiPath Technology Company

USA . 868 parts In-Stock

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$10.041

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868

$10.041

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ChromeModa Solutions

Germany . 3,788 parts In-Stock

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$10.246

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$8.402

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3,788

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$8.402

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

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$10.246

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$9.734

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$9.221

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1,418

$10.246

$9.734

$9.221

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AZTECH Wire

Italy . 208 parts In-Stock

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$10.287

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208

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One Stop Electronics

USA . 744 parts In-Stock

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$535.000

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$535.000

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Corphita

USA . 3,396 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,360 parts In-Stock

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Overview

Unlock seamless and reliable communication with the Texas Instruments LMX5452SMX telecom interface IC. Crafted with precision and quality by a trusted manufacturer, this product offers unparalleled performance and versatility in various applications. From industrial settings to consumer electronics, this advanced technology ensures optimal functionality and efficiency. Experience the value of superior design and engineering with the LMX5452SMX, delivering unmatched benefits and advantages to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology makes it easier to integrate the IC into electronic devices, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easier placement and alignment during manufacturing processes.

Power Supplies (V): 3/3.3

The product is designed to operate at standard power supply voltages, providing compatibility with a wide range of systems.

No. of Terminals: 60

Having a high number of terminals allows for more connections and functionalities, making the IC versatile and capable of handling complex tasks.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style offers high density and connectivity, making it suitable for advanced telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to solder and connect the IC to the system board, simplifying the manufacturing process.

Maximum Time At Peak Reflow Temperature (s): 20

The short reflow time minimizes the risk of overheating the IC during assembly, ensuring quality and reliability.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, the IC can withstand the heat of the soldering process without damage.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means the IC is designed to operate reliably in harsh industrial environments with temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in signal processing.

Terminal Form: BALL

The ball terminal form provides good electrical connection and reliability, ensuring stable performance of the IC.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high density connections, suitable for advanced telecom systems requiring multiple connections.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the IC is able to withstand exposure to moisture during handling and assembly processes, ensuring product quality and reliability.

Technical Specifications

Other Function Telecom Interface ICs LMX5452SMX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B60

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA60,6X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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