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LMK00301ARHSR

Texas Instruments

LMK00301ARHSR by Texas Instruments

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$5.336

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,556 parts In-Stock

1+ parts

$5.336

100+ parts

$4.350

1k+ parts

$2.900

10k+ parts

-

20,556

$5.336

$4.350

$2.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,590 parts In-Stock

1+ parts

$5.069

100+ parts

-

1k+ parts

-

10k+ parts

-

2,590

$5.069

-

-

-

Vyrian

USA . 7,496 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

7,496

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 65 parts In-Stock

1+ parts

$4.802

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$4.802

-

-

-

Andel Nordic

Denmark . 3,696 parts In-Stock

1+ parts

$5.405

100+ parts

-

1k+ parts

$5.189

10k+ parts

$5.189

3,696

$5.405

-

$5.189

$5.189

AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$20.810

100+ parts

-

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-

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-

287

$20.810

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$23.248

100+ parts

$21.156

1k+ parts

$19.063

10k+ parts

-

500

$23.248

$21.156

$19.063

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Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$23.646

100+ parts

-

1k+ parts

$24.279

10k+ parts

-

1,056

$23.646

-

$24.279

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DigiPath Technology Company

USA . 1,220 parts In-Stock

1+ parts

$26.038

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$26.038

-

-

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ChromeModa Solutions

Germany . 3,391 parts In-Stock

1+ parts

$26.569

100+ parts

$21.787

1k+ parts

-

10k+ parts

-

3,391

$26.569

$21.787

-

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IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$26.569

100+ parts

$25.241

1k+ parts

$23.912

10k+ parts

-

2,057

$26.569

$25.241

$23.912

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Lixinc

USA . 6,309 parts In-Stock

1+ parts

-

100+ parts

-

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6,309

-

-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

-

-

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Kepictronics

USA . 160 parts In-Stock

1+ parts

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160

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Technical Specifications

Clock Drivers & Buffers LMK00301ARHSR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

LMK

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.885 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

400 MHz

Trade Compliance

LMK00301ARHSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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