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LM810-2.93MDC

Texas Instruments

LM810-2.93MDC by Texas Instruments

Texas Instruments' LM810-2.93MDC is a Power Management IC with 3.3V Nominal Voltage, -40 to 105°C Operating Temperature range, and 1-5.5V Supply Voltage support. Ideal for industrial applications requiring power supply circuitry in a surface-mount package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,924 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,924

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-

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Digiode

USA . 3,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,540

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-

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Anansix

USA . 1,820 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,032 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,032

$2.500

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Parana Technologies

USA . 470 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

$4.247

10k+ parts

-

470

$3.750

-

$4.247

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ChromeModa Solutions

Germany . 3,831 parts In-Stock

1+ parts

$4.213

100+ parts

$3.455

1k+ parts

-

10k+ parts

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3,831

$4.213

$3.455

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$4.213

100+ parts

-

1k+ parts

$3.792

10k+ parts

-

1,240

$4.213

-

$3.792

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$9.335

100+ parts

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874

$9.335

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DigiPath Technology Company

USA . 1,420 parts In-Stock

1+ parts

-

100+ parts

$3.798

1k+ parts

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10k+ parts

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1,420

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$3.798

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Corphita

USA . 872 parts In-Stock

1+ parts

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100+ parts

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872

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Overview

Enhance the power management of your devices with the LM810-2.93MDC by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers exceptional power management ICs that are essential in various applications. The LM810-2.93MDC offers unmatched value, providing customers with efficient power supply support circuitry while ensuring industrial-grade performance in extreme temperatures. Upgrade your systems with this surface mount device and experience the advantages of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making it suitable for compact electronic devices.

Nominal Supply Voltage (Vsup): 3.3 V

Operates efficiently at a common voltage level of 3.3V, making it compatible with a wide range of electronic systems and devices.

Package Style (Meter): UNCASED CHIP

The uncased chip package style offers flexibility in mounting options and is ideal for applications where size and weight are critical factors.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand elevated temperatures in industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures as low as -40°C, making it suitable for a wide range of environmental conditions.

Terminal Position: UPPER

The upper terminal position ensures easy connectivity and integration into circuits, facilitating the overall assembly process.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, this IC provides stable and efficient power management for various electronic applications.

Minimum Supply Voltage (Vsup): 1 V

Capable of operating at a minimum supply voltage of 1V, offering flexibility in power input requirements and compatibility with low-voltage systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and performance under harsh operating conditions commonly found in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves thermal performance, making it a reliable choice for power management applications.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can support a wide range of voltage inputs, enhancing its versatility in various electronic systems.

Technical Specifications

Power Management ICs LM810-2.93MDC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM810-2.93MDC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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