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LM810-2.63MDC

Texas Instruments

LM810-2.63MDC by Texas Instruments

LM810-2.63MDC by Texas Instruments is a Power Management IC with a supply voltage range of 1V to 5.5V, ideal for industrial applications. This surface-mount chip operates b/w -40°C to 105°C, making it suitable for various power supply support circuits due to its compact uncased package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,007 parts In-Stock

1+ parts

-

100+ parts

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5,007

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Digiode

USA . 3,708 parts In-Stock

1+ parts

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3,708

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Anansix

USA . 1,997 parts In-Stock

1+ parts

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1,997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 839 parts In-Stock

1+ parts

$2.500

100+ parts

-

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839

$2.500

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

$7.755

100+ parts

-

1k+ parts

$8.295

10k+ parts

-

531

$7.755

-

$8.295

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DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$8.539

100+ parts

$7.856

1k+ parts

-

10k+ parts

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1,377

$8.539

$7.856

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ChromeModa Solutions

Germany . 1,821 parts In-Stock

1+ parts

$8.713

100+ parts

$7.145

1k+ parts

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10k+ parts

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1,821

$8.713

$7.145

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IDEA Electronic Components Group

UK . 1,521 parts In-Stock

1+ parts

$8.713

100+ parts

$8.277

1k+ parts

$7.842

10k+ parts

-

1,521

$8.713

$8.277

$7.842

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$8.890

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515

$8.890

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Corphita

USA . 1,007 parts In-Stock

1+ parts

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1,007

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Overview

Discover the LM810-2.63MDC by Texas Instruments, a high-quality Power Management IC designed to meet your industrial needs. With advanced technology and precision manufacturing, Texas Instruments delivers top-notch performance and reliability. Perfect for a wide range of applications, this IC offers unparalleled value and benefits to customers seeking efficient power supply support. Trust Texas Instruments to provide the solutions you need for your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3 V

The specified nominal supply voltage ensures compatibility with a wide range of system requirements and power sources.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers a compact design that is ideal for applications where space is limited.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in industrial environments with elevated temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments or during startup conditions.

Terminal Position: UPPER

The upper terminal position simplifies connection and integration into existing circuit layouts, improving ease of use.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC can enhance the stability and efficiency of power management systems, ensuring consistent performance.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage allows for flexibility in powering the device, enabling operation with a variety of power sources.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the product is designed to meet the demanding requirements of industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joints breaking, enhancing the reliability and durability of the product.

Maximum Supply Voltage (Vsup): 5.5 V

The generous maximum supply voltage allows for compatibility with a wide range of power sources, providing versatility in system design.

Technical Specifications

Power Management ICs LM810-2.63MDC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM810-2.63MDC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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