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LM810-2.63MWC

Texas Instruments

LM810-2.63MWC by Texas Instruments

LM810-2.63MWC by Texas Instruments is a Power Management IC with a supply voltage range of 1V to 5.5V, ideal for industrial applications. This surface-mount chip operates b/w -40°C to 105°C, making it suitable for various temperature conditions. It serves as a power supply support circuit in upper terminal position without leads.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,984 parts In-Stock

1+ parts

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4,984

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Digiode

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

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1,058

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Anansix

USA . 233 parts In-Stock

1+ parts

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233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 448 parts In-Stock

1+ parts

$5.500

100+ parts

-

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448

$5.500

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$5.688

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322

$5.688

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

$22.240

100+ parts

-

1k+ parts

$22.906

10k+ parts

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1,017

$22.240

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$22.906

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DigiPath Technology Company

USA . 1,381 parts In-Stock

1+ parts

$24.489

100+ parts

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1,381

$24.489

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

1+ parts

$24.989

100+ parts

$23.740

1k+ parts

$22.490

10k+ parts

-

1,472

$24.989

$23.740

$22.490

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ChromeModa Solutions

Germany . 370 parts In-Stock

1+ parts

$24.989

100+ parts

$20.491

1k+ parts

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370

$24.989

$20.491

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Corphita

USA . 4,198 parts In-Stock

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4,198

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Overview

Enhance the performance of your power management systems with the LM810-2.63MWC by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the Power Management ICs category. This surface mount chip offers a wide range of applications and operates efficiently in industrial settings. With a nominal supply voltage of 3V and a temperature range from -40 to 105°C, this power supply support circuit ensures optimal functionality. Trust Texas Instruments to provide you with the value, benefits, and advantages you need for your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, making this product suitable for manufacturing and assembly processes.

Nominal Supply Voltage (Vsup): 3 V

Operating at a standard 3V supply voltage ensures compatibility with a wide range of electronic devices and power sources.

Package Style (Meter): UNCASED CHIP

The unencased chip design offers a compact and streamlined form factor, ideal for space-constrained applications and integration into small electronic devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand and perform reliably in demanding industrial environments and high-temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments and provides versatility in various temperature settings.

Terminal Position: UPPER

The upper terminal position simplifies the connection process and enables easy access for testing, servicing, and maintenance of the power management IC.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product enhances the efficiency and stability of power systems, ensuring consistent and reliable power delivery to connected devices.

Minimum Supply Voltage (Vsup): 1 V

The ability to operate at a low minimum supply voltage of 1V allows for energy-efficient performance and compatibility with low-power electronic devices or battery-operated systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets stringent quality and reliability standards, making it suitable for use in industrial automation, control systems, and harsh operating environments.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failure, enhances thermal conductivity, and improves overall reliability and durability of the power management IC.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V, this product is compatible with a wide range of power sources and can accommodate higher voltage requirements for various electronic applications.

Technical Specifications

Power Management ICs LM810-2.63MWC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM810-2.63MWC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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