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LM810-4.63MWC

Texas Instruments

LM810-4.63MWC by Texas Instruments

LM810-4.63MWC by Texas Instruments is a Power Management IC with a supply voltage range of 1V to 5.5V, suitable for industrial applications. This surface-mount chip operates b/w -40°C to 105°C and supports power supply circuits efficiently in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,181 parts In-Stock

1+ parts

-

100+ parts

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5,181

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Anansix

USA . 2,759 parts In-Stock

1+ parts

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1k+ parts

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2,759

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Digiode

USA . 2,548 parts In-Stock

1+ parts

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2,548

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,500 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

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1,500

$0.500

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Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

$6.067

100+ parts

-

1k+ parts

$6.845

10k+ parts

-

2,147

$6.067

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$6.845

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DigiPath Technology Company

USA . 1,616 parts In-Stock

1+ parts

$6.681

100+ parts

$6.146

1k+ parts

-

10k+ parts

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1,616

$6.681

$6.146

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ChromeModa Solutions

Germany . 2,158 parts In-Stock

1+ parts

$6.817

100+ parts

$5.590

1k+ parts

-

10k+ parts

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2,158

$6.817

$5.590

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$6.817

100+ parts

-

1k+ parts

$6.135

10k+ parts

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1,040

$6.817

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$6.135

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$17.954

100+ parts

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867

$17.954

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Corphita

USA . 1,059 parts In-Stock

1+ parts

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1,059

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Overview

Meet the LM810-4.63MWC by Texas Instruments, a top-tier Power Management IC designed to provide reliable and efficient performance in a variety of industrial applications. With a robust design and superior quality from a trusted manufacturer like Texas Instruments, this IC offers exceptional value and benefits for customers seeking precision power supply support. Whether you're looking to optimize energy consumption or enhance system reliability, the LM810-4.63MWC is the perfect solution to meet your needs. Upgrade your power management capabilities today with this innovative IC.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and simplifying production processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes this product compatible with a wide range of electronic systems and components.

Package Style (Meter): UNCASED CHIP

Uncased chip package style offers flexibility in mounting and integration options, making it suitable for various applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide temperature range allows this product to be used in both extreme cold and hot conditions, increasing its versatility and reliability.

Terminal Position: UPPER

Upper terminal position simplifies PCB layout and connection, enhancing ease of installation and maintenance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC helps in regulating and distributing power effectively, ensuring stable operation of connected devices.

Minimum Supply Voltage (Vsup): 1 V

Wide range of minimum supply voltage allows for flexibility in power input requirements, accommodating different power sources and configurations.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets rigorous performance and reliability standards required in harsh environments.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of solder joints and enhances reliability in vibration-prone environments, ensuring long-term stability.

Maximum Supply Voltage (Vsup): 5.5 V

Close proximity of maximum supply voltage to nominal voltage allows for slight overvoltage protection, safeguarding connected components from potential damage.

Technical Specifications

Power Management ICs LM810-4.63MWC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM810-4.63MWC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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