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LM810-3.08MWC

Texas Instruments

LM810-3.08MWC by Texas Instruments

LM810-3.08MWC by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V, suitable for industrial applications. It operates b/w -40°C to 105°C, supports power supply circuits, and has a surface mount package style for easy installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,052 parts In-Stock

1+ parts

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100+ parts

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5,052

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Vyrian

USA . 4,669 parts In-Stock

1+ parts

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-

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4,669

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Anansix

USA . 999 parts In-Stock

1+ parts

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999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,148 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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1,148

$2.500

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AZTECH Wire

Italy . 319 parts In-Stock

1+ parts

$12.621

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319

$12.621

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Parana Technologies

USA . 8 parts In-Stock

1+ parts

$19.427

100+ parts

-

1k+ parts

$19.439

10k+ parts

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8

$19.427

-

$19.439

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DigiPath Technology Company

USA . 2,112 parts In-Stock

1+ parts

$21.391

100+ parts

$19.680

1k+ parts

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2,112

$21.391

$19.680

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IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$21.828

100+ parts

$20.737

1k+ parts

$19.645

10k+ parts

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411

$21.828

$20.737

$19.645

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ChromeModa Solutions

Germany . 73 parts In-Stock

1+ parts

$21.828

100+ parts

$17.899

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73

$21.828

$17.899

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Corphita

USA . 1,776 parts In-Stock

1+ parts

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1,776

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Overview

Elevate your power management game with the LM810-3.08MWC by Texas Instruments. This high-quality IC offers unmatched reliability and precision, making it a top choice for industrial applications. With its compact design and wide operating temperature range, the LM810-3.08MWC provides exceptional value and performance. Trust in Texas Instruments to deliver cutting-edge technology that meets your power supply needs efficiently and effectively.

Feature Benefit Bullets

Surface Mount:YES

The surface mount feature allows for easy integration onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in electronics, making this product compatible with a wide range of devices and power sources.

Package Style (Meter): UNCASED CHIP

The unencased chip design provides flexibility in mounting options and allows for efficient heat dissipation, improving overall product reliability and performance.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can handle demanding industrial environments without overheating, ensuring long-term durability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40°C to 105°C enables this product to function reliably in extreme temperature conditions, making it suitable for a variety of applications.

Terminal Position: UPPER

The upper terminal position simplifies connection to other components and circuitry, enhancing the overall ease of use and installation of this power management IC.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC is designed to efficiently regulate and provide power to various components, making it a crucial component in many electronic devices.

Minimum Supply Voltage (Vsup): 1 V

With a minimum supply voltage of 1V, this IC can operate efficiently even at low power levels, ensuring optimal performance in diverse power scenarios.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates that this product is designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joint cracks and enhances reliability in high-vibration environments, making this IC suitable for rugged applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers versatility in power input options, accommodating a wide range of power sources and ensuring compatibility with various devices.

Technical Specifications

Power Management ICs LM810-3.08MWC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM810-3.08MWC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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