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LDC1314QRGHRQ1

Texas Instruments

LDC1314QRGHRQ1 by Texas Instruments

LDC1314QRGHRQ1 by Texas Instruments is a 16-terminal chip carrier with a nominal voltage of 3.3V, suitable for automotive applications. It operates b/w -40°C to 125°C, has a terminal pitch of 0.5mm, and can handle a max supply voltage of 3.6V.

Median Price

$5.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,943 parts In-Stock

1+ parts

$3.703

100+ parts

$3.058

1k+ parts

$1.653

10k+ parts

-

22,943

$3.703

$3.058

$1.653

-

DigiKey

USA . 244 parts In-Stock

1+ parts

$5.090

100+ parts

$3.241

1k+ parts

$3.094

10k+ parts

$2.781

244

$5.090

$3.241

$3.094

$2.781

Mouser Electronics

USA . 4,048 parts In-Stock

1+ parts

$5.450

100+ parts

$3.470

1k+ parts

$3.150

10k+ parts

$3.050

4,048

$5.450

$3.470

$3.150

$3.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 643 parts In-Stock

1+ parts

$3.518

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$3.518

-

-

-

Vyrian

USA . 3,158 parts In-Stock

1+ parts

$3.703

100+ parts

-

1k+ parts

-

10k+ parts

-

3,158

$3.703

-

-

-

Bristol Electronics

USA . 449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

449

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,001 parts In-Stock

1+ parts

$3.150

100+ parts

-

1k+ parts

-

10k+ parts

-

9,001

$3.150

-

-

-

Corphita

USA . 2,641 parts In-Stock

1+ parts

$3.333

100+ parts

-

1k+ parts

-

10k+ parts

-

2,641

$3.333

-

-

-

Corohmni

South Africa . 491 parts In-Stock

1+ parts

$3.703

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$3.703

-

-

-

Semicontronic

India . 8,775 parts In-Stock

1+ parts

$6.850

100+ parts

$6.679

1k+ parts

$6.644

10k+ parts

-

8,775

$6.850

$6.679

$6.644

-

Parana Technologies

USA . 1,200 parts In-Stock

1+ parts

$11.089

100+ parts

-

1k+ parts

$11.549

10k+ parts

-

1,200

$11.089

-

$11.549

-

ChromeModa Solutions

Germany . 2,575 parts In-Stock

1+ parts

$12.459

100+ parts

$10.216

1k+ parts

-

10k+ parts

-

2,575

$12.459

$10.216

-

-

IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$12.459

100+ parts

$11.836

1k+ parts

$11.213

10k+ parts

-

608

$12.459

$11.836

$11.213

-

Futuretech Components

Singapore . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

-

-

-

-

Microchip USA

USA . 1,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

DigiPath Technology Company

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$11.233

1k+ parts

-

10k+ parts

-

89

-

$11.233

-

-

Overview

Unlock the potential of your automotive applications with the LDC1314QRGHRQ1 by Texas Instruments. Designed with precision and reliability in mind, this analog circuit chip carrier offers a seamless integration with its surface mount feature and quad terminal position. With a wide operating temperature range from -40°C to 125°C, this product ensures superior performance in any environment. Trust in Texas Instruments' expertise to provide you with the quality and value you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto circuit boards, reducing assembly time and costs.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable voltage supply for stable and reliable performance in various electronic applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in demanding environments without risk of overheating.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for secure connections.

Width (mm): 4 mm

Compact width size enables space-saving design and integration into small electronic devices.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise and accurate signal processing for high-quality performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and durability under harsh automotive conditions.

Terminal Form: NO LEAD

No-lead terminal form provides environmentally friendly and RoHS compliant design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates a moderate level of sensitivity to moisture during storage and handling.

Technical Specifications

Other Function Semiconductors LDC1314QRGHRQ1 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LDC1314QRGHRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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